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MC32PF3000A1EPR2

NXP Semiconductors

MC32PF3000A1EPR2 by NXP Semiconductors

MC32PF3000A1EPR2 by NXP Semiconductors is a 48-terminal Power Management IC with a nominal voltage of 3.6V, suitable for industrial applications. It features a max operating temperature of 85°C, MOS technology, and adjustable threshold capability for power supply support circuits.

Median Price

$4.069

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 224 parts In-Stock

1+ parts

$9.010

100+ parts

$5.590

1k+ parts

$4.160

10k+ parts

$4.150

224

$9.010

$5.590

$4.160

$4.150

Arrow

USA . 12,000 parts In-Stock

1+ parts

-

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-

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$4.098

12,000

-

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$4.098

Verical

USA . 4,000 parts In-Stock

1+ parts

-

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$4.040

4,000

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$4.040

Rochester

USA . 1,500 parts In-Stock

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-

100+ parts

$3.890

1k+ parts

$3.480

10k+ parts

$3.270

1,500

-

$3.890

$3.480

$3.270

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.300

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100

$5.300

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Digiode

USA . 4,257 parts In-Stock

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$7.562

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4,257

$7.562

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Chip Stock

USA . 20,500 parts In-Stock

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20,500

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TME

Poland . 12,000 parts In-Stock

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$6.042

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$6.042

Vyrian

USA . 3,597 parts In-Stock

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3,597

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Flip Electronics

USA . 1,500 parts In-Stock

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IBS Electronics

USA . 1,040 parts In-Stock

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$5.031

10k+ parts

$4.966

1,040

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$5.031

$4.966

Anansix

USA . 341 parts In-Stock

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341

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,387 parts In-Stock

1+ parts

$3.430

100+ parts

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$3.430

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Semicontronic

India . 3,370 parts In-Stock

1+ parts

$3.430

100+ parts

$3.344

1k+ parts

$3.327

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3,370

$3.430

$3.344

$3.327

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Continental Prestige Electronics

USA . 3,384 parts In-Stock

1+ parts

$5.300

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$5.194

3,384

$5.300

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$5.194

Modulus Dynamics

Lithuania . 900 parts In-Stock

1+ parts

$5.883

100+ parts

$5.824

1k+ parts

$5.648

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900

$5.883

$5.824

$5.648

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Corphita

USA . 445 parts In-Stock

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$7.164

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$7.164

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Corohmni

South Africa . 14 parts In-Stock

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$8.210

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14

$8.210

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$8.963

100+ parts

$8.515

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$8.515

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350

$8.963

$8.515

$8.515

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Aztec Data Supply Inc.

USA . 353 parts In-Stock

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$11.762

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$11.762

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Microchip USA

USA . 5,163 parts In-Stock

1+ parts

$28.880

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$28.700

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$28.610

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$28.520

5,163

$28.880

$28.700

$28.610

$28.520

Lixinc

USA . 16,067 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Futuretech Components

Singapore . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Argo Parts USA

USA . 2,320 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$5.194

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$5.035

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$4.929

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$5.194

$5.035

$4.929

A-Z Elektronik GmbH

Germany . 1,545 parts In-Stock

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UNI Independent Distributors

Spain . 832 parts In-Stock

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Overview

Unlock the power of efficient energy management with the MC32PF3000A1EPR2 by NXP Semiconductors. Designed for industrial-grade applications, this Power Management IC offers unparalleled reliability and performance. With a compact square shape and surface mount capabilities, it provides 12 channels of power supply support circuitry. Experience the benefits of adjustable thresholds and a wide temperature range, making it ideal for a variety of industrial settings. Trust in NXP Semiconductors' reputation for quality and innovation, and take your energy management to the next level with the MC32PF3000A1EPR2.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a surface, making installation convenient and efficient.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal supply voltage level for efficient performance and power management.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style ensures effective heat dissipation, compact design, and overall durability of the product.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliability in various environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without affecting performance.

Maximum Seated Height: 0.9 mm

Low profile design allows for compact integration in space-constrained applications.

Technology: MOS

Utilizes Metal-Oxide-Semiconductor technology for efficient power management and high performance.

Maximum Supply Voltage (Vsup): 4.5 V

Allows for a higher supply voltage range, offering flexibility in power input options.

Adjustable Threshold: YES

The threshold can be adjusted as needed, providing customizable power management solutions.

Technical Specifications

Power Management ICs MC32PF3000A1EPR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7 mm

Trade Compliance

MC32PF3000A1EPR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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