Loading...

MC32PF3001A3EP

NXP Semiconductors

MC32PF3001A3EP by NXP Semiconductors

MC32PF3001A3EP by NXP Semiconductors is a Power Management IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.8V to 4.5V and features adjustable threshold with 10 channels for industrial applications in compact square package style.

Median Price

$7.720

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 310 parts In-Stock

1+ parts

$7.720

100+ parts

$5.034

1k+ parts

$4.658

10k+ parts

$4.545

310

$7.720

$5.034

$4.658

$4.545

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$4.980

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$4.980

-

-

-

Digiode

USA . 445 parts In-Stock

1+ parts

$6.280

100+ parts

-

1k+ parts

-

10k+ parts

-

445

$6.280

-

-

-

Vyrian

USA . 4,296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,296

-

-

-

-

Anansix

USA . 2,798 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,798

-

-

-

-

Flip Electronics

USA . 230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

230

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 518 parts In-Stock

1+ parts

$4.980

100+ parts

-

1k+ parts

-

10k+ parts

$4.880

518

$4.980

-

-

$4.880

Ampacity Inc.

Singapore . 681 parts In-Stock

1+ parts

$5.620

100+ parts

-

1k+ parts

-

10k+ parts

-

681

$5.620

-

-

-

Corphita

USA . 3,429 parts In-Stock

1+ parts

$5.949

100+ parts

-

1k+ parts

-

10k+ parts

-

3,429

$5.949

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$7.318

100+ parts

$6.952

1k+ parts

$6.952

10k+ parts

-

500

$7.318

$6.952

$6.952

-

Semicontronic

India . 678 parts In-Stock

1+ parts

$12.230

100+ parts

$11.924

1k+ parts

$11.863

10k+ parts

-

678

$12.230

$11.924

$11.863

-

Aztec Data Supply Inc.

USA . 104 parts In-Stock

1+ parts

$17.640

100+ parts

-

1k+ parts

-

10k+ parts

-

104

$17.640

-

-

-

Microchip USA

USA . 2,588 parts In-Stock

1+ parts

$19.152

100+ parts

-

1k+ parts

-

10k+ parts

-

2,588

$19.152

-

-

-

Corohmni

South Africa . 317 parts In-Stock

1+ parts

$20.568

100+ parts

-

1k+ parts

-

10k+ parts

-

317

$20.568

-

-

-

UNI Independent Distributors

Spain . 7,627 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,627

-

-

-

-

iodParts Technologies Inc.

India . 5,428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,428

-

-

-

-

Argo Parts USA

USA . 4,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,845

-

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Perfect Parts

USA . 2,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,330

-

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$4.880

1k+ parts

$4.731

10k+ parts

$4.631

100

-

$4.880

$4.731

$4.631

Overview

Unlock the power of efficient energy management with the MC32PF3001A3EP by NXP Semiconductors. This Power Management IC offers unparalleled reliability and performance, thanks to the renowned quality of its manufacturer. Ideal for a wide range of applications, this product provides customers with valuable benefits such as optimized power supply support and customizable threshold adjustments. Experience the advantages of cutting-edge technology and seamless integration with the MC32PF3001A3EP.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to integrate into surface mount PCB designs.

Package Shape: SQUARE

Allows for efficient use of space on the PCB.

Nominal Supply Voltage (Vsup): 3.6 V

Ideal for applications requiring stable power supply at 3.6 V.

No. of Terminals: 48

Provides flexibility in connection options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers advanced thermal management capabilities in a compact form factor.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in high temperature environments.

Minimum Operating Temperature: -40 °C

Allows for use in extreme cold conditions.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance.

Terminal Position: QUAD

Facilitates easy soldering and connection.

Maximum Seated Height: 0.9 mm

Enables low profile design applications.

Width (mm): 7 mm

Offers a compact footprint for space-constrained designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Provides comprehensive power management solutions.

Minimum Supply Voltage (Vsup): 2.8 V

Allows for operation at lower supply voltages.

Maximum Time At Peak Reflow Temperature: 40s

Ensures reliable soldering during assembly processes.

Peak Reflow Temperature: 260 C

Withstands high temperature reflow soldering.

Length: 7 mm

Contributes to the compact form factor of the IC.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature conditions.

No. of Channels: 10

Offers multiple channels for enhanced power management capabilities.

Terminal Form: NO LEAD

Environmentally friendly and RoHS compliant.

Terminal Pitch: 0.5 mm

Enables close spacing of terminals for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

Indicates level of moisture sensitivity during storage and handling.

Maximum Supply Voltage (Vsup): 4.5 V

Supports applications requiring higher supply voltages.

Adjustable Threshold: YES

Allows for customization of threshold values for specific application requirements.

Technical Specifications

Power Management ICs MC32PF3001A3EP attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Additional Features:

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7 mm

Trade Compliance

MC32PF3001A3EP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20