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UCD3138RHAR

Texas Instruments

UCD3138RHAR by Texas Instruments

UCD3138RHAR by Texas Instruments is a Power Management IC with 8 outputs. It operates in temperatures from -40 to 125°C, suitable for automotive applications. The chip carrier package style has a very thin profile and nickel palladium gold terminal finish.

Median Price

$7.360

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,136 parts In-Stock

1+ parts

$7.360

100+ parts

$6.000

1k+ parts

$4.000

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12,136

$7.360

$6.000

$4.000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,495 parts In-Stock

1+ parts

$6.992

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3,495

$6.992

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Vyrian

USA . 2,386 parts In-Stock

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$7.360

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2,386

$7.360

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,212 parts In-Stock

1+ parts

$2.783

100+ parts

-

1k+ parts

$3.269

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1,212

$2.783

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$3.269

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DigiPath Technology Company

USA . 373 parts In-Stock

1+ parts

$3.064

100+ parts

$2.819

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373

$3.064

$2.819

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ChromeModa Solutions

Germany . 4,573 parts In-Stock

1+ parts

$3.127

100+ parts

$2.564

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4,573

$3.127

$2.564

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IDEA Electronic Components Group

UK . 2,159 parts In-Stock

1+ parts

$3.127

100+ parts

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$2.814

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2,159

$3.127

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$2.814

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Ampacity Inc.

Singapore . 7,260 parts In-Stock

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$6.260

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$6.260

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Semicontronic

India . 7,165 parts In-Stock

1+ parts

$6.260

100+ parts

$6.104

1k+ parts

$6.072

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7,165

$6.260

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$6.072

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Corphita

USA . 1,639 parts In-Stock

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$6.624

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1,639

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Corohmni

South Africa . 257 parts In-Stock

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$7.360

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257

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Lixinc

USA . 13,893 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,373 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Experience superior power management with the UCD3138RHAR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a high-quality Power Management IC that is perfect for automotive applications. With its compact square shape and advanced features, this chip carrier offers customers unparalleled value and benefits. Say goodbye to overheating and unstable power supplies with the UCD3138RHAR, providing reliability and efficiency for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product.

Surface Mount: YES

Ease of installation and space-saving design.

Maximum Operating Temperature: 125 °C

Ensures stable operation even under high temperatures.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for various environments.

Maximum Seated Height: 1 mm

Low profile design for compact devices.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper reflow of the product during manufacturing process.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature fluctuations are common.

Maximum Supply Current (Isup): 100 mA

Can handle a decent amount of current for power management needs.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture, increasing product longevity.

No. of Outputs: 8

Can support multiple output channels for versatile power distribution.

Technical Specifications

Power Management ICs UCD3138RHAR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Outputs:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

UCD3138RHAR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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