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UCD3138RMHT

Texas Instruments

UCD3138RMHT by Texas Instruments

Texas Instruments UCD3138RMHT is a Power Management IC with 8 outputs. It operates in Automotive grade temperature range (-40 to 125°C) and has a max supply current of 100mA. This chip carrier package with very thin profile is suitable for power supply management circuits in various applications.

Median Price

$17.530

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 56 parts In-Stock

1+ parts

$21.310

100+ parts

$14.810

1k+ parts

$13.910

10k+ parts

-

56

$21.310

$14.810

$13.910

-

DigiKey

USA . 444 parts In-Stock

1+ parts

$21.950

100+ parts

$15.484

1k+ parts

$14.328

10k+ parts

-

444

$21.950

$15.484

$14.328

-

Rochester

USA . 275 parts In-Stock

1+ parts

-

100+ parts

$11.000

1k+ parts

$9.840

10k+ parts

$9.260

275

-

$11.000

$9.840

$9.260

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$13.750

1k+ parts

$12.300

10k+ parts

$11.575

250

-

$13.750

$12.300

$11.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,183 parts In-Stock

1+ parts

$10.288

100+ parts

-

1k+ parts

-

10k+ parts

-

1,183

$10.288

-

-

-

Vyrian

USA . 4,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,526

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 227 parts In-Stock

1+ parts

$9.210

100+ parts

-

1k+ parts

-

10k+ parts

-

227

$9.210

-

-

-

Semicontronic

India . 227 parts In-Stock

1+ parts

$9.210

100+ parts

$8.980

1k+ parts

$8.934

10k+ parts

-

227

$9.210

$8.980

$8.934

-

Corphita

USA . 4,541 parts In-Stock

1+ parts

$9.747

100+ parts

-

1k+ parts

-

10k+ parts

-

4,541

$9.747

-

-

-

Corohmni

South Africa . 50 parts In-Stock

1+ parts

$10.830

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$10.830

-

-

-

Parana Technologies

USA . 625 parts In-Stock

1+ parts

$13.057

100+ parts

$1,212.558

1k+ parts

$11.751

10k+ parts

-

625

$13.057

$1,212.558

$11.751

-

DigiPath Technology Company

USA . 532 parts In-Stock

1+ parts

$14.378

100+ parts

$13.227

1k+ parts

-

10k+ parts

-

532

$14.378

$13.227

-

-

ChromeModa Solutions

Germany . 6,423 parts In-Stock

1+ parts

$14.671

100+ parts

$12.030

1k+ parts

-

10k+ parts

-

6,423

$14.671

$12.030

-

-

IDEA Electronic Components Group

UK . 106 parts In-Stock

1+ parts

$14.671

100+ parts

$13.937

1k+ parts

$13.204

10k+ parts

-

106

$14.671

$13.937

$13.204

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Lixinc

USA . 1,793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,793

-

-

-

-

Perfect Parts

USA . 263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

263

-

-

-

-

A-Z Elektronik GmbH

Germany . 126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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126

-

-

-

-

Overview

Experience superior power management with the UCD3138RMHT by Texas Instruments. As a trusted industry leader, Texas Instruments delivers top-quality Power Management ICs designed to optimize performance and efficiency in a variety of applications. Whether you're working on automotive electronics or industrial automation, this innovative product offers unmatched value, benefits, and advantages. Say goodbye to overheating and inefficiency - choose the UCD3138RMHT for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the PCB.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design helps in managing heat dissipation effectively.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can withstand demanding operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and connection to other components.

Width (mm): 6 mm

The compact width of 6 mm makes the product suitable for applications with space constraints.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this IC helps in efficient power distribution and management.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during manufacturing processes.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates the product is designed to withstand the temperature fluctuations experienced in automotive environments.

Maximum Supply Current (Isup): 100 mA

The maximum supply current of 100 mA allows for powering multiple outputs efficiently.

Terminal Form: NO LEAD

The no lead terminal form reduces the risk of lead contamination and makes the product environmentally friendly.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates moderate sensitivity to moisture, ensuring proper handling and storage requirements.

No. of Outputs: 8

Having 8 outputs enables the IC to manage and distribute power to multiple components effectively.

Technical Specifications

Power Management ICs UCD3138RMHT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Outputs:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.75 mm

Maximum Supply Current (Isup):

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

UCD3138RMHT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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