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UCD3138RGCR

Texas Instruments

UCD3138RGCR by Texas Instruments

UCD3138RGCR by Texas Instruments is a Power Management IC with 8 outputs. It operates in temperatures from -40 to 125°C, making it suitable for automotive applications. The chip carrier package style has a very thin profile and nickel palladium gold terminal finish.

Median Price

$11.618

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,726 parts In-Stock

1+ parts

$8.366

100+ parts

$7.308

1k+ parts

$5.040

10k+ parts

-

5,726

$8.366

$7.308

$5.040

-

Mouser Electronics

USA . 690 parts In-Stock

1+ parts

$14.870

100+ parts

$9.550

1k+ parts

$7.920

10k+ parts

$7.750

690

$14.870

$9.550

$7.920

$7.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,303 parts In-Stock

1+ parts

$7.948

100+ parts

-

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-

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3,303

$7.948

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Vyrian

USA . 3,595 parts In-Stock

1+ parts

$8.366

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-

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-

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3,595

$8.366

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Chip Stock

USA . 19,595 parts In-Stock

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19,595

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,195 parts In-Stock

1+ parts

$7.110

100+ parts

$6.932

1k+ parts

$6.897

10k+ parts

-

3,195

$7.110

$6.932

$6.897

-

Corphita

USA . 4,834 parts In-Stock

1+ parts

$7.529

100+ parts

-

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-

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4,834

$7.529

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-

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Parana Technologies

USA . 2,230 parts In-Stock

1+ parts

$7.654

100+ parts

-

1k+ parts

$8.177

10k+ parts

-

2,230

$7.654

-

$8.177

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Corohmni

South Africa . 238 parts In-Stock

1+ parts

$8.366

100+ parts

-

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-

10k+ parts

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238

$8.366

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DigiPath Technology Company

USA . 961 parts In-Stock

1+ parts

$8.428

100+ parts

$7.754

1k+ parts

-

10k+ parts

-

961

$8.428

$7.754

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-

ChromeModa Solutions

Germany . 3,386 parts In-Stock

1+ parts

$8.600

100+ parts

$7.052

1k+ parts

-

10k+ parts

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3,386

$8.600

$7.052

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IDEA Electronic Components Group

UK . 36 parts In-Stock

1+ parts

$8.600

100+ parts

$8.170

1k+ parts

$7.740

10k+ parts

-

36

$8.600

$8.170

$7.740

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A-Z Elektronik GmbH

Germany . 11,400 parts In-Stock

1+ parts

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11,400

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Lixinc

USA . 8,576 parts In-Stock

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8,576

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Kepictronics

USA . 7,034 parts In-Stock

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7,034

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Perfect Parts

USA . 112 parts In-Stock

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112

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Overview

Experience reliable and efficient power management with the UCD3138RGCR by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers high-quality Power Management ICs that are perfect for automotive applications. With features like quad terminal position and no lead terminal form, this chip carrier offers ease of use and top performance. Ensure your devices operate at their best with the UCD3138RGCR, providing stability and precision in every application. Elevate your power management solutions with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the Power Management IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy installation and integration onto circuit boards, saving time and effort in the assembly process.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this Power Management IC can withstand challenging environmental conditions without compromising performance.

Width (mm): 9 mm

A compact width of 9mm enables space-saving design and efficient use of board real estate, ideal for applications with size constraints.

No. of Outputs: 8

Having 8 outputs allows for the Power Management IC to efficiently power multiple components or subsystems within a system, providing flexibility and versatility in usage.

Technical Specifications

Power Management ICs UCD3138RGCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

2

No. of Outputs:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.88 mm

Maximum Supply Current (Isup):

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

9 mm

Trade Compliance

UCD3138RGCR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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