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UCD3138064RMHT

Texas Instruments

UCD3138064RMHT by Texas Instruments

UCD3138064RMHT by Texas Instruments is a Power Management IC with 3.3V supply voltage, 40 terminals, and 8 outputs. It is designed for automotive applications, featuring a temperature range of -40 to 125°C and a compact square package style suitable for surface mount assembly.

Median Price

$14.336

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,000 parts In-Stock

1+ parts

$14.336

100+ parts

$12.522

1k+ parts

$8.636

10k+ parts

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1,000

$14.336

$12.522

$8.636

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,651 parts In-Stock

1+ parts

$13.619

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2,651

$13.619

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Chip Stock

USA . 16,011 parts In-Stock

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Vyrian

USA . 1,976 parts In-Stock

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1,976

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 688 parts In-Stock

1+ parts

$12.190

100+ parts

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688

$12.190

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Semicontronic

India . 593 parts In-Stock

1+ parts

$12.190

100+ parts

$11.885

1k+ parts

$11.824

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593

$12.190

$11.885

$11.824

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Corphita

USA . 3,717 parts In-Stock

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$12.902

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3,717

$12.902

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Corohmni

South Africa . 201 parts In-Stock

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$14.336

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201

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Parana Technologies

USA . 1,556 parts In-Stock

1+ parts

$15.157

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$15.559

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1,556

$15.157

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$15.559

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IDEA Electronic Components Group

UK . 1,322 parts In-Stock

1+ parts

$17.030

100+ parts

$16.178

1k+ parts

$15.327

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1,322

$17.030

$16.178

$15.327

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ChromeModa Solutions

Germany . 777 parts In-Stock

1+ parts

$17.030

100+ parts

$13.965

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777

$17.030

$13.965

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AZTECH Wire

Italy . 248 parts In-Stock

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$18.240

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DigiPath Technology Company

USA . 2,227 parts In-Stock

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$15.354

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2,227

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Perfect Parts

USA . 280 parts In-Stock

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Overview

Experience the next level of power management with the UCD3138064RMHT by Texas Instruments. Known for their high-quality products, Texas Instruments continues to innovate in the Power Management ICs category. This chip carrier package offers a very thin profile and nickel palladium gold terminal finish, making it perfect for automotive applications. With 8 outputs and a wide operating temperature range, this IC provides unmatched reliability and efficiency. Trust Texas Instruments to deliver superior performance for all your power supply management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the integrated circuit, ensuring a long lifespan for the product.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a common standard in many electronic devices, making this power management IC compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this power management IC can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that this power management IC can function effectively in cold environments.

No. of Outputs: 8

Having 8 outputs allows this power management IC to manage multiple power sources efficiently, making it suitable for complex electronics systems.

Technical Specifications

Power Management ICs UCD3138064RMHT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

8

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

UCD3138064RMHT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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