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TMX320F28235PGFA

Texas Instruments

TMX320F28235PGFA by Texas Instruments

TMX320F28235PGFA by Texas Instruments is a 32-bit DSP with 20-bit address bus, operating at max 35 MHz. Ideal for industrial applications, it features low power mode, boundary scan support, and CMOS technology for efficient signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,759 parts In-Stock

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Digiode

USA . 3,945 parts In-Stock

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3,945

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Distributors (Availability)

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AZTECH Wire

Italy . 697 parts In-Stock

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$15.287

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One Stop Electronics

USA . 1,061 parts In-Stock

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$21.000

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Parana Technologies

USA . 150 parts In-Stock

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$28.899

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$53.081

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$28.899

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DigiPath Technology Company

USA . 1,015 parts In-Stock

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$31.822

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$29.276

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$31.822

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ChromeModa Solutions

Germany . 3,986 parts In-Stock

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$32.471

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$26.626

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IDEA Electronic Components Group

UK . 1,708 parts In-Stock

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$32.471

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$30.847

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$29.224

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$29.224

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Corohmni

South Africa . 2,356 parts In-Stock

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$34.010

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Component Stockers USA

USA . 355 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 13,810 parts In-Stock

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Microchip USA

USA . 5,414 parts In-Stock

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Corphita

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Overview

Experience the cutting-edge technology of the TMX320F28235PGFA from Texas Instruments, a top-tier manufacturer known for its high-quality digital signal processors. This versatile product is ideal for a wide range of applications in industries such as telecommunications, automotive, and consumer electronics. With its advanced features and exceptional performance, this DSP offers customers unmatched value, benefits, and advantages that will take their projects to the next level. Trust Texas Instruments to deliver innovation and reliability with the TMX320F28235PGFA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.96 V

Ability to operate at a maximum supply voltage of 1.96V provides flexibility in power supply options.

Address Bus Width: 20

A wider address bus width of 20 allows for efficient memory addressing and data processing.

Package Shape: SQUARE

The square package shape enables easy placement and alignment during manufacturing.

Bit Size: 32

A 32-bit architecture allows for high-speed processing and computation capabilities.

Power Supplies (V): 1.9,3.3

Support for multiple power supply options (1.9V and 3.3V) increases compatibility with various systems.

No. of Terminals: 176

A higher number of terminals provide more input/output options for connectivity.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options offer versatility in mounting and installation in different systems.

Minimum Supply Voltage: 1.84 V

Operational at a low minimum supply voltage of 1.84V ensures energy efficiency.

Maximum Operating Temperature: 85 °C

Ability to withstand high operating temperatures of up to 85°C makes it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures down to -40°C for reliable performance in harsh environments.

Terminal Position: QUAD

Quad terminal position provides stability and robust connectivity in the assembly.

Maximum Seated Height: 1.6 mm

A low maximum seated height of 1.6mm saves space and allows for compact designs.

RAM Words: 34816

Ample RAM words storage capacity of 34816 ensures efficient data handling and processing.

Width: 24 mm

A compact width of 24mm facilitates integration into various electronic devices.

Boundary Scan: YES

Boundary scan capability helps in debugging and testing the device for improved reliability.

External Data Bus Width: 32

A wide external data bus width of 32 ensures high-speed data transfer and processing.

Maximum Clock Frequency: 35 MHz

Support for a maximum clock frequency of 35MHz enables fast signal processing and computation.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for parallel data processing and improved performance.

Length: 24 mm

A compact length of 24mm facilitates space-saving design and integration in tight spaces.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grade (-40°C to 85°C) for reliable operation in harsh environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports various peripheral IC types for enhanced functionality and versatility in applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and easy soldering during assembly.

Nominal Supply Voltage: 1.9 V

Nominal supply voltage of 1.9V ensures stable and consistent operation of the device.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5mm allows for high-density mounting and compact PCB designs.

Format: FIXED POINT

Fixed-point format enables efficient arithmetic operations and precise calculations.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMX320F28235PGFA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

35 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of Terminals:

176

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Words:

34816

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.96 V

Minimum Supply Voltage:

1.84 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMX320F28235PGFA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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