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TMX320C6678CYP

Texas Instruments

TMX320C6678CYP by Texas Instruments

TMX320C6678CYP by Texas Instruments is a 32-bit DSP with max clock freq of 1000 MHz. It operates in industrial temp range (-40 to 85 °C) and has 841 terminals in grid array package style. Ideal for digital signal processing applications requiring low power mode and floating point format.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,510 parts In-Stock

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Digiode

USA . 2,060 parts In-Stock

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2,060

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Rebound Electronics

UK . 4 parts In-Stock

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Sensible Micro Corp

USA . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 421 parts In-Stock

1+ parts

$7.137

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421

$7.137

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One Stop Electronics

USA . 915 parts In-Stock

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$10.000

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915

$10.000

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Parana Technologies

USA . 329 parts In-Stock

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$31.059

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$71.936

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$31.059

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DigiPath Technology Company

USA . 1,318 parts In-Stock

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$34.200

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$31.464

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IDEA Electronic Components Group

UK . 2,320 parts In-Stock

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$34.898

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$33.153

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$31.408

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$34.898

$33.153

$31.408

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ChromeModa Solutions

Germany . 1,321 parts In-Stock

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$34.898

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$28.616

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Corohmni

South Africa . 35 parts In-Stock

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$43.036

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S.R.D Solutions

India . 12,000 parts In-Stock

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Corphita

USA . 1,529 parts In-Stock

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Kepictronics

USA . 271 parts In-Stock

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Microchip USA

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 2 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMX320C6678CYP by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers cutting-edge technology that is perfect for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial automation, this DSP offers exceptional value and benefits. With its powerful features and high clock frequency, this product provides customers with a reliable solution to meet their needs. Upgrade your projects today with the TMX320C6678CYP and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection for the internal components of the DSP, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature makes the DSP easy to integrate into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V allows for efficient power consumption while providing sufficient voltage for the DSP to operate effectively.

Package Shape: SQUARE

The square package shape ensures easy handling and mounting of the DSP, making it suitable for various design configurations.

Bit Size: 32

With a 32-bit size, the DSP can handle complex algorithms and processing tasks efficiently, making it ideal for high-performance applications.

Power Supplies (V): 1,1.5/1.8

The multiple power supply options allow for flexibility in voltage requirements, making the DSP compatible with a wide range of power sources.

No. of Terminals: 841

With 841 terminals, the DSP offers ample connectivity options for interfacing with other components, enabling versatile functionality.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout for the terminals, enhancing signal integrity and facilitating high-speed data processing.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95 V ensures compatibility with low-power systems, making the DSP energy-efficient and suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the DSP can withstand high temperatures in industrial environments, ensuring reliable performance under challenging conditions.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows the DSP to function effectively in cold environments without compromising its performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and assembly process, making it easier to integrate the DSP into electronic systems.

Maximum Seated Height: 3.427 mm

The maximum seated height of 3.427 mm ensures a low-profile design for the DSP, enabling compact and space-saving system architectures.

RAM Words: 65536

With 65536 RAM words, the DSP has ample memory capacity for storing and processing data, enabling efficient operation of complex algorithms and applications.

Width: 24 mm

The 24 mm width provides a compact form factor for the DSP, allowing for easy integration into various electronic devices and systems.

Boundary Scan: YES

The boundary scan feature simplifies testing and debugging of the DSP, improving reliability and ensuring accurate functionality in the final product.

Maximum Clock Frequency: 1000 MHz

With a maximum clock frequency of 1000 MHz, the DSP can process data at high speeds, enabling real-time signal processing and rapid computation.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for efficient data transfer within the DSP, enhancing performance and enabling seamless communication between components.

Length: 24 mm

The 24 mm length of the DSP contributes to its compact design, making it suitable for space-constrained applications without compromising on functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation of the DSP in harsh environmental conditions, making it suitable for industrial applications where durability is essential.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP's peripheral IC type, combined with its digital signal processing capabilities, enables efficient processing of digital signals and data, making it a versatile choice for various applications.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption and high-speed operation, making it energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form simplifies the mounting and connection of the DSP, enabling easy integration into electronic systems and reducing assembly complexity.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V provides stable power input for the DSP, ensuring consistent and reliable performance in various operating conditions.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for high-density mounting of the DSP, maximizing board space utilization and enabling compact system designs.

Format: FLOATING POINT

The floating-point format used in the DSP enables precise and accurate numerical calculations, making it suitable for applications requiring high computational accuracy and precision.

Low Power Mode: YES

The low power mode feature enhances the energy efficiency of the DSP, allowing for extended battery life and reducing power consumption in standby or idle states.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C6678CYP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

1000 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

Length:

24 mm

Low Power Mode:

YES

No. of Terminals:

841

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1,1.5/1.8

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

3.427 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMX320C6678CYP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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