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SN74S481JQ4

Texas Instruments

SN74S481JQ4 by Texas Instruments

SN74S481JQ4 by Texas Instruments is a Bit-Slice Micro Processor with 48 terminals in an IN-LINE package. Operating temperature ranges from 0°C to 70°C, suitable for commercial applications. Utilizes TTL technology and ceramic package material for robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,360 parts In-Stock

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8,360

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Digiode

USA . 2,194 parts In-Stock

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2,194

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 287 parts In-Stock

1+ parts

$13.335

100+ parts

-

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287

$13.335

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One Stop Electronics

USA . 1,473 parts In-Stock

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$14.000

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1,473

$14.000

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Corohmni

South Africa . 2,614 parts In-Stock

1+ parts

$16.732

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2,614

$16.732

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Parana Technologies

USA . 1,471 parts In-Stock

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$51.032

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1,471

$51.032

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DigiPath Technology Company

USA . 1,452 parts In-Stock

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$56.192

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1,452

$56.192

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ChromeModa Solutions

Germany . 5,113 parts In-Stock

1+ parts

$57.339

100+ parts

$47.018

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5,113

$57.339

$47.018

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IDEA Electronic Components Group

UK . 1,514 parts In-Stock

1+ parts

$57.339

100+ parts

$54.472

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$51.605

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1,514

$57.339

$54.472

$51.605

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Corphita

USA . 4,440 parts In-Stock

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4,440

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Overview

Experience cutting-edge technology with the SN74S481JQ4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. The SN74S481JQ4 falls under the category of Bit-Slice Micro Processors, offering unparalleled performance and reliability. With a package body material made of ceramic and a rectangular shape, this product boasts 48 terminals and a quad terminal position. Perfect for a wide range of applications, this commercial-grade bit-slice microprocessor is sure to enhance your projects with its superior technology and precision engineering. Unlock endless possibilities with the SN74S481JQ4 today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal stability and durability, making them ideal for applications where temperature fluctuations may occur.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space and can be easily mounted on PCBs.

No. of Terminals: 48

Having 48 terminals provides sufficient connectivity options for interfacing with other components in a system.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can perform reliably in a variety of environments.

Minimum Operating Temperature: 0 °C

The ability to operate at 0°C ensures functionality even in colder conditions.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Being a bit-slice microprocessor, this product offers high performance and versatility in handling various processes and tasks efficiently.

Technology: TTL

TTL technology is known for its reliability and fast operation, making this product suitable for applications that require quick data processing.

Technical Specifications

Bit-Slice Micro Processors SN74S481JQ4 attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-XQIP-P48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

QIP

Package Equivalence Code:

QUIP48A,.6/.8

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SN74S481JQ4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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