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SN74ACT8818GC

Texas Instruments

SN74ACT8818GC by Texas Instruments

SN74ACT8818GC by Texas Instruments is a CMOS Bit-Slice Micro Processor with 85 terminals, operating at 5V. It features a ceramic square package style and grid array shape, suitable for commercial applications requiring microprogram sequencing and bit-slice processing. Operating temperature ranges from 0 to 70°C with low supply current of 0.2 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,112 parts In-Stock

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Digiode

USA . 1,672 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$16.775

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217

$16.775

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Corohmni

South Africa . 236 parts In-Stock

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$18.609

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One Stop Electronics

USA . 986 parts In-Stock

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$35.000

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986

$35.000

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Parana Technologies

USA . 507 parts In-Stock

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$75.088

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507

$75.088

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DigiPath Technology Company

USA . 2,139 parts In-Stock

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$82.681

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$82.681

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ChromeModa Solutions

Germany . 3,174 parts In-Stock

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$84.368

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$69.182

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IDEA Electronic Components Group

UK . 323 parts In-Stock

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$84.368

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$80.150

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$75.931

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323

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$75.931

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Corphita

USA . 1,382 parts In-Stock

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Overview

Discover the innovative SN74ACT8818GC by Texas Instruments, a top-of-the-line bit-slice microprocessor that offers unparalleled quality and reliability. With a package body material made of ceramic and a grid array package style, this product is designed to withstand even the most demanding applications. From microprogram sequencing to bit-slice processing, this versatile IC type delivers exceptional performance. Trust in Texas Instruments to provide cutting-edge technology that ensures your projects run smoothly and efficiently. Unlock the potential of your designs with the SN74ACT8818GC.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent heat resistance and durability, ensuring reliable performance over an extended period of time.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of power sources and simplifies integration into existing systems.

No. of Terminals: 85

Having a high number of terminals allows for more connections and interfaces, enabling greater flexibility in system design and functionality.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can handle demanding environmental conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high integration capabilities, making it ideal for efficient and reliable microprocessor operation.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies system integration.

Technical Specifications

Bit-Slice Micro Processors SN74ACT8818GC attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P85

No. of Terminals:

85

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA85M,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

SN74ACT8818GC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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