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SN74AS890FN

Texas Instruments

SN74AS890FN by Texas Instruments

SN74AS890FN by Texas Instruments is a Bit-Slice Micro Processor with 14-bit external data bus width, operating at up to 22.22 MHz clock frequency. It is used in applications requiring microprogram sequencing and features TTL technology, with a package style of chip carrier for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,908 parts In-Stock

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4,908

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Vyrian

USA . 2,924 parts In-Stock

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2,924

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 337 parts In-Stock

1+ parts

$17.891

100+ parts

$1,661.430

1k+ parts

$16.102

10k+ parts

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337

$17.891

$1,661.430

$16.102

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DigiPath Technology Company

USA . 1,981 parts In-Stock

1+ parts

$19.700

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1,981

$19.700

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AZTECH Wire

Italy . 864 parts In-Stock

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$19.772

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864

$19.772

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ChromeModa Solutions

Germany . 6,526 parts In-Stock

1+ parts

$20.102

100+ parts

$16.484

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6,526

$20.102

$16.484

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IDEA Electronic Components Group

UK . 686 parts In-Stock

1+ parts

$20.102

100+ parts

$19.097

1k+ parts

$18.092

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686

$20.102

$19.097

$18.092

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One Stop Electronics

USA . 670 parts In-Stock

1+ parts

$23.000

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670

$23.000

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Corohmni

South Africa . 5,201 parts In-Stock

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$59.195

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5,201

$59.195

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Corphita

USA . 1,395 parts In-Stock

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1,395

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Overview

Enhance your electronic projects with the SN74AS890FN by Texas Instruments, a top-quality bit-slice microprocessor that delivers superior performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this chip carrier package offers endless possibilities for applications in various industries. From microprogram sequencing to data processing, this versatile processor boasts a wide external data bus width of 14 and a maximum clock frequency of 22.22 MHz. Elevate your projects with the unmatched value, benefits, and advantages that the SN74AS890FN brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material makes this product lightweight and durable, suitable for various electronic applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto a printed circuit board, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage tolerance of 5.5 V provides flexibility and reliability in different power supply scenarios, ensuring stable operation.

Package Shape: SQUARE

Square package shape saves space on the PCB and allows for efficient placement in compact electronic devices.

No. of Terminals: 68

Having 68 terminals allows for versatile connectivity options and interfaces with other components, making the product suitable for complex system designs.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides mechanical and thermal protection for the internals, ensuring reliability and longevity of the product.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement of 4.5 V allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can withstand harsh environmental conditions and operate reliably in various thermal environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the product can function effectively even in cold temperature settings.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connection, enhancing the overall reliability of the product in different applications.

Maximum Seated Height: 4.57 mm

The low maximum seated height of 4.57 mm allows for a compact design and facilitates integration into space-constrained electronic devices.

Width: 24.2062 mm

The moderate width of 24.2062 mm provides a balance between size and functionality, making the product suitable for various electronic applications.

External Data Bus Width: 14

With an external data bus width of 14, this product can efficiently handle data processing and communication tasks, making it suitable for high-performance applications.

Maximum Clock Frequency: 22.22 MHz

The high maximum clock frequency of 22.22 MHz enables fast and efficient processing, making the product ideal for applications requiring high-speed data handling.

Length: 24.2062 mm

The matching length of 24.2062 mm complements the width and overall dimensions, optimizing the product for integration in electronic systems.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards and specifications, ensuring compatibility and reliability in various commercial applications.

Peripheral IC Type: BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

The inclusion of bit-slice processor and microprogram sequencer as peripheral IC types enhances the functionality and capability of the product, making it suitable for diverse computing tasks.

Technology: TTL

Utilizing TTL technology provides compatibility with a wide range of electronic systems and components, ensuring seamless integration and reliable performance.

Terminal Form: J BEND

J bend terminal form offers secure and durable connections, reducing the risk of disconnection or signal loss, making the product suitable for robust applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V simplifies power management and ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product allows for precise and compact PCB layout, enabling efficient and reliable connectivity in densely populated electronic designs.

Technical Specifications

Bit-Slice Micro Processors SN74AS890FN attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

Maximum Clock Frequency:

22.22 MHz

External Data Bus Width:

14

JESD-30 Code:

S-PQCC-J68

Length:

24.2062 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bit-Slice Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.2062 mm

Trade Compliance

SN74AS890FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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