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ADSP-1401TN+

Analog Devices

ADSP-1401TN+ by Analog Devices

Analog Devices' ADSP-1401TN+ is a Bit-Slice Micro Processor with 16-bit external data bus width, CMOS technology, and MILITARY temperature grade. It features 48 terminals in a rectangular package style for applications requiring microprogram sequencing and bit-slice processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,695 parts In-Stock

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6,695

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Digiode

USA . 335 parts In-Stock

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335

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Semicontronic

India . 514 parts In-Stock

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$2.000

100+ parts

$1.950

1k+ parts

$1.940

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514

$2.000

$1.950

$1.940

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AZTECH Wire

Italy . 328 parts In-Stock

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$6.882

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328

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One Stop Electronics

USA . 568 parts In-Stock

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$10.000

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568

$10.000

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Corohmni

South Africa . 300 parts In-Stock

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$30.398

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300

$30.398

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Parana Technologies

USA . 2,217 parts In-Stock

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$49.770

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$46.286

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2,217

$49.770

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$46.286

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IDEA Electronic Components Group

UK . 589 parts In-Stock

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$53.516

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$50.840

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589

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$50.840

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DigiPath Technology Company

USA . 1,159 parts In-Stock

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$83.485

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$80.146

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$80.146

1,159

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$80.146

Native Components

USA . 955 parts In-Stock

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Corphita

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Northwest PG Solutions

USA . 309 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the ADSP-1401TN+ by Analog Devices. Designed to deliver unparalleled performance in a compact package, this Bit-Slice Micro Processor is perfect for a wide range of applications. With its military-grade temperature grade and advanced CMOS technology, this processor provides optimal reliability and efficiency. Whether you're a tech enthusiast or an industry professional, the ADSP-1401TN+ offers unbeatable value and benefits that will take your projects to the next level. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material in the package body provides good durability and protection for the internal components of the microprocessor.

Package Shape: RECTANGULAR

The RECTANGULAR shape of the package allows for easy integration into various electronic systems and circuit boards.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with other components and peripherals in the system.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this microprocessor can withstand demanding operating conditions without performance degradation.

Technology: CMOS

Being based on CMOS technology, this microprocessor offers low power consumption and high noise immunity, making it efficient and reliable for various applications.

Technical Specifications

Bit-Slice Micro Processors ADSP-1401TN+ attributes and parameters. Explore more Bit-Slice Micro Processors devices from Analog Devices

Specs

External Data Bus Width:

16

JESD-30 Code:

R-PDIP-T48

JESD-609 Code:

e0

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

ADSP-1401TN+ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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