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SN74AS895-1FN

Texas Instruments

SN74AS895-1FN by Texas Instruments

SN74AS895-1FN by Texas Instruments is a Bit-Slice Micro Processor with 8-bit external data bus width, operating at 5V nominal voltage. It features a quad terminal position and J bend terminal form, suitable for applications requiring direct memory address generation in commercial temperature grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,343 parts In-Stock

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Digiode

USA . 4,517 parts In-Stock

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4,517

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Distributors (Availability)

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AZTECH Wire

Italy . 672 parts In-Stock

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$14.546

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672

$14.546

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One Stop Electronics

USA . 888 parts In-Stock

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$34.000

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Corohmni

South Africa . 5,198 parts In-Stock

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$55.864

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Parana Technologies

USA . 895 parts In-Stock

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$69.400

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895

$69.400

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DigiPath Technology Company

USA . 2,039 parts In-Stock

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$76.418

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$70.305

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2,039

$76.418

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ChromeModa Solutions

Germany . 5,779 parts In-Stock

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$77.978

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$63.942

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$63.942

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IDEA Electronic Components Group

UK . 1,340 parts In-Stock

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$77.978

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$74.079

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$70.180

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Corphita

USA . 4,859 parts In-Stock

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Overview

Elevate your electronic designs with the SN74AS895-1FN by Texas Instruments, a top-tier manufacturer in the industry. This bit-slice microprocessor offers unmatched quality and reliability, perfect for a wide range of applications. From direct memory address generation to processing tasks, this chip carrier package delivers exceptional value and performance. Trust Texas Instruments to provide cutting-edge technology that meets your needs, giving you a competitive edge in the market. Experience the benefits of superior design and innovation with the SN74AS895-1FN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, ideal for applications where weight and cost are important factors.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production time.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in system design.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board, enabling compact and densely packed designs.

No. of Terminals: 68

With a high number of terminals, this product offers versatile connectivity options for interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER

The chip carrier package style ensures easy handling and installation, making it suitable for automated assembly processes.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage allows for operation in low-power environments, making the product energy-efficient.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions, enhancing product durability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature guarantees functionality even in cold environments, increasing the product's versatility.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection, reducing the risk of signal interference or loss.

Maximum Seated Height: 4.57 mm

The low maximum seated height helps in designing slim and compact devices without compromising on performance.

Width: 24.2062 mm

The moderate width of the product allows for efficient placement on the circuit board, optimizing space utilization.

External Data Bus Width: 8

An external data bus width of 8 bits facilitates high-speed data transfer and processing, enhancing overall system performance.

Length: 24.2062 mm

The length of the product complements its width, providing a well-balanced form factor for seamless integration into electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard operating conditions, making the product suitable for a wide range of applications.

Peripheral IC Type: BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR

The inclusion of a bit-slice processor and a direct memory address generator enhances the product's processing capabilities and data handling efficiency.

Technology: TTL

Using TTL technology ensures compatibility with a variety of TTL-based systems, offering flexibility and ease of integration.

Terminal Form: J BEND

The J bend terminal form facilitates secure connections and reliable signal transmission, reducing the risk of connectivity issues.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a standard in many electronic systems, ensuring widespread compatibility and ease of integration.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for precise and compact circuit board layout, enabling high-density component placement.

Technical Specifications

Bit-Slice Micro Processors SN74AS895-1FN attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.2062 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.2062 mm

Trade Compliance

SN74AS895-1FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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