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SN74ACT8818FN

Texas Instruments

SN74ACT8818FN by Texas Instruments

SN74ACT8818FN by Texas Instruments is a CMOS Bit-Slice Micro Processor with 84 terminals, operating at 5V. It features a max supply current of 0.2mA and is designed for microprogram sequencing applications in commercial-grade environments. The chip carrier package style with J bend terminals makes it suitable for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,336 parts In-Stock

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8,336

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Digiode

USA . 2,444 parts In-Stock

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2,444

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 226 parts In-Stock

1+ parts

$8.505

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226

$8.505

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One Stop Electronics

USA . 990 parts In-Stock

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$27.000

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990

$27.000

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Parana Technologies

USA . 540 parts In-Stock

1+ parts

$53.772

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540

$53.772

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ChromeModa Solutions

Germany . 3,194 parts In-Stock

1+ parts

$60.418

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$49.543

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3,194

$60.418

$49.543

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IDEA Electronic Components Group

UK . 582 parts In-Stock

1+ parts

$60.418

100+ parts

$57.397

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$54.376

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582

$60.418

$57.397

$54.376

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Corohmni

South Africa . 40 parts In-Stock

1+ parts

$76.866

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40

$76.866

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DigiPath Technology Company

USA . 2,270 parts In-Stock

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$54.473

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2,270

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$54.473

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Corphita

USA . 1,063 parts In-Stock

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1,063

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Overview

Unlock the power of cutting-edge technology with the SN74ACT8818FN from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. The SN74ACT8818FN falls under the category of Bit-Slice Micro Processors, offering high performance and reliability for a wide range of applications. With its advanced features and innovative design, this product provides unmatched value and benefits to customers, making it the perfect choice for your next project. Choose Texas Instruments for excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for package body material makes this product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable makes it easier to mass-produce and enables efficient PCB design.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with various systems and power sources.

No. of Terminals: 84

Having 84 terminals allows for versatile connectivity and integration within a system.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product is suitable for use in various environments.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the product's efficiency.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility and stability in different applications.

Technical Specifications

Bit-Slice Micro Processors SN74ACT8818FN attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J84

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC84,1.2SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74ACT8818FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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