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SN74AS890-1GB

Texas Instruments

SN74AS890-1GB by Texas Instruments

SN74AS890-1GB by Texas Instruments is a Bit-Slice Micro Processor with 68 terminals in a ceramic square package. Operating temperature range is 0-70°C, suitable for commercial applications. It features TTL technology and serves as a microprogram sequencer in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,032 parts In-Stock

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3,032

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Digiode

USA . 1,234 parts In-Stock

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1,234

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 433 parts In-Stock

1+ parts

$5.000

100+ parts

-

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433

$5.000

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AZTECH Wire

Italy . 368 parts In-Stock

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$8.456

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368

$8.456

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Parana Technologies

USA . 295 parts In-Stock

1+ parts

$32.007

100+ parts

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$94.336

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295

$32.007

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$94.336

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DigiPath Technology Company

USA . 687 parts In-Stock

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$35.244

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687

$35.244

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IDEA Electronic Components Group

UK . 2,372 parts In-Stock

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$35.963

100+ parts

$34.165

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$32.367

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2,372

$35.963

$34.165

$32.367

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ChromeModa Solutions

Germany . 1,829 parts In-Stock

1+ parts

$35.963

100+ parts

$29.490

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1,829

$35.963

$29.490

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Corohmni

South Africa . 61 parts In-Stock

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$38.786

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61

$38.786

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Corphita

USA . 2,200 parts In-Stock

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2,200

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Overview

Discover the cutting-edge technology of the SN74AS890-1GB by Texas Instruments, a top-tier manufacturer known for its quality and reliability. This innovative Bit-Slice Micro Processor offers unparalleled performance and versatility in a variety of applications. From microprogram sequencing to data processing, this product excels in delivering fast and efficient results. Invest in the SN74AS890-1GB today and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides good thermal conductivity, making it suitable for high-temperature environments and ensuring the reliability of the product.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, maximizing component density and improving overall system performance.

No. of Terminals: 68

Having 68 terminals provides a sufficient number of connections for various inputs and outputs, enhancing the flexibility and functionality of the microprocessor.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this microprocessor can reliably function in a wide range of operating conditions, ensuring consistent performance.

Technology: TTL

TTL technology offers high-speed performance and low power consumption, making this microprocessor an efficient choice for processing tasks.

Technical Specifications

Bit-Slice Micro Processors SN74AS890-1GB attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

SN74AS890-1GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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