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SN74AS888-1GB

Texas Instruments

SN74AS888-1GB by Texas Instruments

SN74AS888-1GB by Texas Instruments is a Bit-Slice Micro Processor with 8-bit external data bus width. Operating at 4.5V to 5.5V, it has a max supply current of 520mA and operates in commercial temperature grade (0°C to 70°C). Its package style is grid array, with a square shape and ceramic, metal-sealed cofired body material.

Median Price

$61.650

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,189 parts In-Stock

1+ parts

-

100+ parts

$54.800

1k+ parts

$49.030

10k+ parts

$46.140

2,189

-

$54.800

$49.030

$46.140

DigiKey

USA . 2,189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,189

-

-

-

-

Verical

USA . 2,189 parts In-Stock

1+ parts

-

100+ parts

$68.500

1k+ parts

$61.288

10k+ parts

$57.675

2,189

-

$68.500

$61.288

$57.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,131 parts In-Stock

1+ parts

$57.846

100+ parts

-

1k+ parts

-

10k+ parts

-

4,131

$57.846

-

-

-

Vyrian

USA . 680 parts In-Stock

1+ parts

$60.890

100+ parts

-

1k+ parts

-

10k+ parts

-

680

$60.890

-

-

-

DigiKey Marketplace

USA . 2,189 parts In-Stock

1+ parts

$63.330

100+ parts

-

1k+ parts

-

10k+ parts

-

2,189

$63.330

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 3,217 parts In-Stock

1+ parts

$41.689

100+ parts

-

1k+ parts

-

10k+ parts

-

3,217

$41.689

-

-

-

Parana Technologies

USA . 316 parts In-Stock

1+ parts

$42.320

100+ parts

$3,930.008

1k+ parts

$38.088

10k+ parts

-

316

$42.320

$3,930.008

$38.088

-

DigiPath Technology Company

USA . 726 parts In-Stock

1+ parts

$46.599

100+ parts

$42.871

1k+ parts

-

10k+ parts

-

726

$46.599

$42.871

-

-

ChromeModa Solutions

Germany . 4,971 parts In-Stock

1+ parts

$47.550

100+ parts

$38.991

1k+ parts

-

10k+ parts

-

4,971

$47.550

$38.991

-

-

IDEA Electronic Components Group

UK . 1,791 parts In-Stock

1+ parts

$47.550

100+ parts

$45.172

1k+ parts

$42.795

10k+ parts

-

1,791

$47.550

$45.172

$42.795

-

Corphita

USA . 1,168 parts In-Stock

1+ parts

$54.801

100+ parts

-

1k+ parts

-

10k+ parts

-

1,168

$54.801

-

-

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A-Z Elektronik GmbH

Germany . 7,379 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,379

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-

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Assy Fe

Spain . 6 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6

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Overview

Experience the power of cutting-edge technology with the Texas Instruments SN74AS888-1GB Bit-Slice Micro Processor. Crafted with precision and expertise, this innovative product offers unparalleled performance and reliability for a wide range of applications. From industrial automation to telecommunications, the SN74AS888-1GB delivers exceptional value and efficiency to meet all your processing needs. Trust in Texas Instruments for superior quality and stay ahead of the curve with this state-of-the-art solution. Elevate your projects with the SN74AS888-1GB and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and protection for the internal components of the microprocessor, making it reliable for long-term use.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage allows for flexibility in power input and ensures stable performance under varying voltage conditions.

Package Shape: SQUARE

The square shape of the package maximizes space efficiency during installation and allows for a compact design in electronic systems.

No. of Terminals: 68

The high number of terminals provides ample connectivity options for interfacing with other components, enhancing the versatility of the microprocessor.

Minimum Supply Voltage: 4.5 V

The lower minimum supply voltage ensures compatibility with a wide range of power sources, making it suitable for various applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the microprocessor to function reliably in demanding environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the microprocessor remains operational even in cold environments, increasing its usability in diverse settings.

Terminal Position: PERPENDICULAR

The perpendicular terminal position facilitates easy connection and installation of the microprocessor on circuit boards, simplifying the assembly process.

Maximum Seated Height: 4.57 mm

The low seated height allows for a slim profile when the microprocessor is mounted, saving space and enabling compact designs in electronic devices.

Width: 27.94 mm

The moderate width of the microprocessor enables easy integration into various electronic systems without occupying excessive space.

External Data Bus Width: 8

The 8-bit external data bus width allows for efficient data processing and transfer, enhancing the overall performance of the microprocessor in handling complex tasks.

Length: 27.94 mm

The moderate length of the microprocessor complements its width, contributing to a balanced form factor that is suitable for diverse applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the microprocessor is designed for standard operating conditions in commercial electronic devices, ensuring compatibility and reliability in typical usage scenarios.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

The bit-slice microprocessor design offers flexibility in customizing the processing capabilities of the chip, making it suitable for a wide range of applications that require specialized computations.

Technology: TTL

The use of TTL technology ensures fast and reliable signal processing within the microprocessor, resulting in efficient performance and accurate data handling.

Terminal Form: PIN/PEG

The pin/peg terminal form provides a secure and stable connection for interfacing the microprocessor with external components, reducing the risk of signal loss or disconnection.

Maximum Supply Current: 520 mA

The high maximum supply current capability allows the microprocessor to draw sufficient power to support demanding operations, ensuring consistent performance under heavy workloads.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a standard operating voltage in many electronic systems, making the microprocessor compatible with a wide range of devices and power sources.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm provides adequate spacing between terminals for easy soldering and connection, enhancing the usability and reliability of the microprocessor in circuit board assembly.

Technical Specifications

Bit-Slice Micro Processors SN74AS888-1GB attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P68

Length:

27.94 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bit-Slice Processors

Maximum Supply Current:

520 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27.94 mm

Peripheral IC Type:

Trade Compliance

SN74AS888-1GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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