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SN74LS481JQP4

Texas Instruments

SN74LS481JQP4 by Texas Instruments

SN74LS481JQP4 by Texas Instruments is a Bit-Slice Micro Processor with 48 terminals in an IN-LINE package. Operating temperature ranges from 0°C to 70°C, suitable for commercial-grade applications. Utilizes TTL technology and ceramic package material, ideal for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,192 parts In-Stock

1+ parts

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7,192

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Digiode

USA . 3,498 parts In-Stock

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3,498

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 876 parts In-Stock

1+ parts

$11.350

100+ parts

-

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876

$11.350

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One Stop Electronics

USA . 1,315 parts In-Stock

1+ parts

$25.000

100+ parts

-

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1,315

$25.000

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Corohmni

South Africa . 3,035 parts In-Stock

1+ parts

$27.334

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3,035

$27.334

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Parana Technologies

USA . 893 parts In-Stock

1+ parts

$29.646

100+ parts

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$61.572

10k+ parts

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893

$29.646

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$61.572

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DigiPath Technology Company

USA . 1,895 parts In-Stock

1+ parts

$32.644

100+ parts

$30.032

1k+ parts

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10k+ parts

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1,895

$32.644

$30.032

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ChromeModa Solutions

Germany . 4,904 parts In-Stock

1+ parts

$33.310

100+ parts

$27.314

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4,904

$33.310

$27.314

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IDEA Electronic Components Group

UK . 1,499 parts In-Stock

1+ parts

$33.310

100+ parts

$31.644

1k+ parts

$29.979

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1,499

$33.310

$31.644

$29.979

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Corphita

USA . 4,336 parts In-Stock

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4,336

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Overview

Unlock the power of advanced technology with the SN74LS481JQP4 from Texas Instruments. Designed for high-performance applications, this Bit-Slice Micro Processor offers unparalleled quality and reliability. Whether you're in the industrial, automotive, or consumer electronics industry, this product delivers superior value and performance. Trust Texas Instruments for cutting-edge solutions that drive innovation and success. Elevate your projects to the next level with the SN74LS481JQP4.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body provides excellent thermal conductivity and also offers good protection against external environmental factors, making this product durable and reliable.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space and easy integration into various electronic systems.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for connecting with other components and peripherals, enhancing the versatility of this product.

Package Style (Meter): IN-LINE

In-line package style simplifies the assembly process and facilitates easy PCB layout, making it convenient for manufacturers to integrate this product into their designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperatures without compromising performance, ensuring its reliability in diverse operating conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows this product to operate efficiently even in colder environments, making it suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection, minimizing the risk of signal loss or interference, which is essential for maintaining the product's performance.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that this product meets industry standards for performance and reliability, making it a suitable choice for commercial applications.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Being a bit-slice microprocessor, this product offers efficient processing capabilities for handling complex tasks, enhancing the overall performance of electronic systems.

Technology: TTL

TTL technology provides fast and reliable signal processing, improving the speed and accuracy of data handling, which is crucial for applications requiring real-time processing.

Terminal Form: PIN/PEG

Pin/peg terminal form ensures easy installation and secure connection, reducing the risk of signal loss or mechanical failure, enhancing the overall reliability of the product.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product offers compatibility with standard PCB layouts, making it easy to integrate into existing electronic designs.

Technical Specifications

Bit-Slice Micro Processors SN74LS481JQP4 attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-XQIP-P48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

QIP

Package Equivalence Code:

QUIP48A,.6/.8

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SN74LS481JQP4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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