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SBP0401ACN

Texas Instruments

SBP0401ACN by Texas Instruments

Texas Instruments SBP0401ACN is a 40-terminal bit-slice microprocessor with bipolar technology. Operating temperature range of 0-70°C makes it ideal for commercial applications. Its rectangular plastic/epoxy package style and through-hole terminal form ensure reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,431 parts In-Stock

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8,431

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Digiode

USA . 3,587 parts In-Stock

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3,587

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 375 parts In-Stock

1+ parts

$16.040

100+ parts

-

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375

$16.040

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Corohmni

South Africa . 5,123 parts In-Stock

1+ parts

$16.812

100+ parts

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5,123

$16.812

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One Stop Electronics

USA . 485 parts In-Stock

1+ parts

$18.000

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485

$18.000

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Parana Technologies

USA . 32 parts In-Stock

1+ parts

$46.964

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32

$46.964

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ChromeModa Solutions

Germany . 5,601 parts In-Stock

1+ parts

$52.769

100+ parts

$43.271

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5,601

$52.769

$43.271

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IDEA Electronic Components Group

UK . 2,364 parts In-Stock

1+ parts

$52.769

100+ parts

$50.131

1k+ parts

$47.492

10k+ parts

-

2,364

$52.769

$50.131

$47.492

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Corphita

USA . 2,523 parts In-Stock

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2,523

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DigiPath Technology Company

USA . 979 parts In-Stock

1+ parts

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$47.577

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979

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$47.577

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Overview

Experience unparalleled performance and reliability with the Texas Instruments SBP0401ACN Bit-Slice Micro Processor. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality in every product they create. Ideal for a wide range of applications, this innovative processor offers customers exceptional value and benefits. Whether you're looking to enhance your system's speed or streamline operations, the SBP0401ACN is the perfect solution for all your processing needs. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material helps to reduce weight and cost while providing good protection for the internal components.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices and circuit boards.

No. of Terminals: 40

Having 40 terminals allows for a higher level of connectivity and functionality within the device.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in a wide range of temperature conditions.

Temperature Grade: COMMERCIAL

Commercial grade temperature range makes this product suitable for a variety of consumer electronics applications.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Bit-slice microprocessor technology offers high computational power and efficiency for processing tasks.

Technology: BIPOLAR

Bipolar technology provides high speed and low power consumption for efficient operation.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connections for reliable performance in demanding conditions.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy soldering and integration into existing circuit designs.

Technical Specifications

Bit-Slice Micro Processors SBP0401ACN attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SBP0401ACN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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