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SBP0400ACJ

Texas Instruments

SBP0400ACJ by Texas Instruments

Texas Instruments SBP0400ACJ is a Bit-Slice Micro Processor with 40 terminals. It operates b/w 0-70°C, suitable for commercial applications. Utilizes bipolar technology in ceramic package, rectangular shape, and through-hole terminals at 2.54mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,645 parts In-Stock

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7,645

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Digiode

USA . 3,406 parts In-Stock

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3,406

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Distributors (Availability)

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AZTECH Wire

Italy . 626 parts In-Stock

1+ parts

$18.229

100+ parts

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626

$18.229

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Corohmni

South Africa . 166 parts In-Stock

1+ parts

$31.866

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166

$31.866

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One Stop Electronics

USA . 1,059 parts In-Stock

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$34.000

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1,059

$34.000

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Parana Technologies

USA . 427 parts In-Stock

1+ parts

$40.474

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427

$40.474

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DigiPath Technology Company

USA . 20 parts In-Stock

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$44.566

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20

$44.566

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ChromeModa Solutions

Germany . 4,266 parts In-Stock

1+ parts

$45.476

100+ parts

$37.290

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4,266

$45.476

$37.290

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IDEA Electronic Components Group

UK . 124 parts In-Stock

1+ parts

$45.476

100+ parts

$43.202

1k+ parts

$40.928

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124

$45.476

$43.202

$40.928

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Corphita

USA . 196 parts In-Stock

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196

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Overview

Experience the cutting-edge technology of Texas Instruments with the SBP0400ACJ Bit-Slice Micro Processor. Known for their high-quality components, Texas Instruments delivers top-of-the-line products for a wide range of applications. Whether you're looking to enhance your industrial processes or improve your electronic designs, this product offers unmatched value and performance. Trust Texas Instruments to provide reliable solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer high thermal conductivity, low electrical resistance, and excellent resistance to harsh environmental conditions, making them ideal for high-performance microprocessors.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient and allow for easy integration into circuit boards, optimizing overall system design.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for various input and output devices, enhancing the versatility of the microprocessor.

Package Style (Meter): IN-LINE

In-line package style offers straightforward installation and connection within circuitry, simplifying assembly and maintenance processes.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70°C ensures reliable performance even in demanding thermal conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0°C allows the microprocessor to function effectively in colder environments, increasing its usability in various settings.

Terminal Position: DUAL

Dual terminal positions enhance electrical stability and reduce signal interference, ensuring consistent and accurate data processing.

Temperature Grade: COMMERCIAL

Designed for commercial use, this microprocessor meets industry standards for performance and reliability, making it a dependable choice for business and consumer applications.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

The use of bit-slice microprocessor technology enables efficient data processing and control functions, making this product suitable for complex computing tasks.

Technology: BIPOLAR

Bipolar technology offers high-speed operation, low power consumption, and excellent noise immunity, enhancing the overall performance and stability of the microprocessor.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and facilitate easier soldering during assembly, ensuring long-term reliability and ease of maintenance.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm optimizes signal transmission and connection density, allowing for efficient data transfer and integration within complex electronic systems.

Technical Specifications

Bit-Slice Micro Processors SBP0400ACJ attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SBP0400ACJ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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