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SBP0400AMJ

Texas Instruments

SBP0400AMJ by Texas Instruments

Texas Instruments SBP0400AMJ is a military-grade bit-slice microprocessor with 40 terminals. Operating temperature ranges from -55°C to 125°C. Utilizes bipolar technology, ceramic package, and through-hole terminal form for robust performance in demanding applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,181 parts In-Stock

1+ parts

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4,181

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Digiode

USA . 575 parts In-Stock

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575

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 139 parts In-Stock

1+ parts

$8.000

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-

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139

$8.000

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AZTECH Wire

Italy . 580 parts In-Stock

1+ parts

$19.545

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580

$19.545

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Corohmni

South Africa . 448 parts In-Stock

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$35.350

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448

$35.350

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Parana Technologies

USA . 1,775 parts In-Stock

1+ parts

$64.953

100+ parts

$6,031.880

1k+ parts

$58.458

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1,775

$64.953

$6,031.880

$58.458

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DigiPath Technology Company

USA . 525 parts In-Stock

1+ parts

$71.521

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525

$71.521

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ChromeModa Solutions

Germany . 3,217 parts In-Stock

1+ parts

$72.981

100+ parts

$59.844

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3,217

$72.981

$59.844

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IDEA Electronic Components Group

UK . 1,938 parts In-Stock

1+ parts

$72.981

100+ parts

$69.332

1k+ parts

$65.683

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1,938

$72.981

$69.332

$65.683

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Corphita

USA . 301 parts In-Stock

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301

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Overview

Upgrade your electronic devices with the SBP0400AMJ by Texas Instruments, a top-of-the-line Bit-Slice Micro Processor that delivers unparalleled performance and reliability. Manufactured with precision and expertise, this product offers cutting-edge technology in a durable ceramic package, perfect for military-grade applications. With 40 terminals and a wide operating temperature range, this processor provides exceptional value and benefits to customers seeking high-quality components for their projects. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages have excellent thermal conductivity, allowing for efficient heat dissipation, which is crucial for high-performance microprocessors.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space in electronic circuits and makes it easier to integrate into existing designs.

No. of Terminals: 40

Having a higher number of terminals allows for more connectivity options and functionality in the microprocessor.

Package Style (Meter): IN-LINE

In-line package style is commonly used and easily mountable on circuit boards, making it convenient for manufacturers.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability even under demanding conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in a wide range of environments, making it versatile and durable.

Terminal Position: DUAL

Dual terminal position allows for more efficient routing of connections and reduces signal interference, ensuring reliable performance.

Temperature Grade: MILITARY

Military-grade components undergo rigorous testing and have high reliability, making them ideal for mission-critical applications where failure is not an option.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Bit-slice microprocessors offer modular and scalable design, allowing for customization and optimization for specific applications.

Technology: BIPOLAR

Bipolar technology provides high-speed operation and precise control, making it suitable for applications that require real-time processing and accuracy.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, making them ideal for applications where mechanical stress and vibrations are a concern.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration into existing PCB designs and provides compatibility with widely available connectors and sockets.

Technical Specifications

Bit-Slice Micro Processors SBP0400AMJ attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SBP0400AMJ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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