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SN74S481N

Texas Instruments

SN74S481N by Texas Instruments

SN74S481N by Texas Instruments is a Bit-Slice Micro Processor with 48 terminals in an IN-LINE package. Operating temperature range of 0-70°C, suitable for commercial applications. Utilizes TTL technology and features a rectangular plastic/epoxy package body.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,969 parts In-Stock

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7,969

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Digiode

USA . 4,096 parts In-Stock

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4,096

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Distributors (Availability)

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One Stop Electronics

USA . 1,333 parts In-Stock

1+ parts

$3.000

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1,333

$3.000

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AZTECH Wire

Italy . 522 parts In-Stock

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$7.576

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522

$7.576

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Corohmni

South Africa . 5,224 parts In-Stock

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$39.971

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5,224

$39.971

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Parana Technologies

USA . 1,376 parts In-Stock

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$64.152

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1,376

$64.152

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DigiPath Technology Company

USA . 1,053 parts In-Stock

1+ parts

$70.639

100+ parts

$64.988

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1,053

$70.639

$64.988

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ChromeModa Solutions

Germany . 3,350 parts In-Stock

1+ parts

$72.081

100+ parts

$59.106

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3,350

$72.081

$59.106

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IDEA Electronic Components Group

UK . 996 parts In-Stock

1+ parts

$72.081

100+ parts

$68.477

1k+ parts

$64.873

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996

$72.081

$68.477

$64.873

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Corphita

USA . 2,484 parts In-Stock

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2,484

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Overview

Elevate your electronic projects with the SN74S481N by Texas Instruments, a top-quality bit-slice microprocessor that delivers exceptional performance and reliability. Manufactured by industry leader Texas Instruments, this innovative product offers unparalleled value and countless benefits for customers seeking cutting-edge technology. With a wide range of applications in various industries, the SN74S481N is the perfect solution for those looking to take their projects to the next level. Experience the advantage of Texas Instruments quality and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and durable, making the product reliable and easy to handle.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing systems and circuit boards.

No. of Terminals: 48

Having 48 terminals provides flexibility in connecting to other components and peripherals.

Package Style (Meter): IN-LINE

In-line package style saves space and allows for efficient use of PCB real estate.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand various environmental conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures the product can function in cooler environments.

Terminal Position: QUAD

Quad terminal position enables easy connectivity and reduces the risk of misalignment during installation.

Temperature Grade: COMMERCIAL

Commercial grade temperature ratings make this product suitable for a wide range of applications in everyday use.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

This specific IC type offers efficient processing capabilities and is ideal for tasks requiring data manipulation and control.

Technology: TTL

TTL technology provides fast and reliable signal processing, enhancing the overall performance of the product.

Terminal Form: PIN/PEG

Pin and peg terminal form ensures secure connections and easy installation.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this product allows for precise and reliable connections to other components.

Technical Specifications

Bit-Slice Micro Processors SN74S481N attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-PQIP-P48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QIP

Package Equivalence Code:

QUIP48A,.6/.8

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SN74S481N Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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