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SNC54S482J

Texas Instruments

SNC54S482J by Texas Instruments

SNC54S482J by Texas Instruments is a Bit-Slice Micro Processor with MIL-STD-883 Class B screening. It operates b/w -55°C to 125°C, featuring 20 terminals in an IN-LINE package style. Ideal for military-grade applications requiring TTL technology and ceramic package material.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,295 parts In-Stock

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Digiode

USA . 3,280 parts In-Stock

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Electronic Expediters

USA . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 602 parts In-Stock

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$15.018

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602

$15.018

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One Stop Electronics

USA . 1,131 parts In-Stock

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$17.000

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$17.000

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Parana Technologies

USA . 681 parts In-Stock

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$26.918

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$30.048

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681

$26.918

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$30.048

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DigiPath Technology Company

USA . 910 parts In-Stock

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$29.640

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910

$29.640

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ChromeModa Solutions

Germany . 6,738 parts In-Stock

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$30.245

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$24.801

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$24.801

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IDEA Electronic Components Group

UK . 885 parts In-Stock

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$30.245

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$28.733

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$27.220

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885

$30.245

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$27.220

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Corohmni

South Africa . 2,573 parts In-Stock

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$76.363

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Corphita

USA . 1,533 parts In-Stock

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Overview

Enhance your electronic designs with the SNC54S482J by Texas Instruments, a high-quality bit-slice microprocessor that delivers superior performance and reliability. Manufactured by industry leader Texas Instruments, this versatile component is ideal for a wide range of applications, from aerospace to telecommunications. With its MILITARY-grade temperature rating and durable CERAMIC body material, this processor ensures long-lasting durability and seamless operation in even the harshest environments. Trust Texas Instruments to provide cutting-edge technology and unparalleled value with the SNC54S482J.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides excellent thermal conductivity and high temperature resistance, making it suitable for military-grade applications.

Screening Level: MIL-STD-883 Class B (Modified)

The modified MIL-STD-883 Class B screening level ensures high reliability and quality control, essential for mission-critical operations in military environments.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand harsh environmental conditions and extended operation without compromising performance.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making it ideal for high-speed computing and energy-efficient applications.

Technical Specifications

Bit-Slice Micro Processors SNC54S482J attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SNC54S482J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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