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SNJ54AS890FD

Texas Instruments

SNJ54AS890FD by Texas Instruments

SNJ54AS890FD by Texas Instruments is a Bit-Slice Micro Processor with 14-bit external data bus width, operating at a max clock frequency of 22.22 MHz. Ideal for military applications, it features a ceramic, metal-sealed cofired package body material and operates within a temperature range of -55 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,716 parts In-Stock

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Vyrian

USA . 3,459 parts In-Stock

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3,459

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Distributors (Availability)

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AZTECH Wire

Italy . 884 parts In-Stock

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$18.347

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884

$18.347

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One Stop Electronics

USA . 1,252 parts In-Stock

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$20.000

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Parana Technologies

USA . 577 parts In-Stock

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$23.652

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$24.284

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577

$23.652

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DigiPath Technology Company

USA . 1,919 parts In-Stock

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$26.044

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$23.960

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1,919

$26.044

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IDEA Electronic Components Group

UK . 1,199 parts In-Stock

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$26.575

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$25.246

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$23.918

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$23.918

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ChromeModa Solutions

Germany . 339 parts In-Stock

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$26.575

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$21.792

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339

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$21.792

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Corohmni

South Africa . 23 parts In-Stock

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$85.327

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Corphita

USA . 1,224 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the SNJ54AS890FD by Texas Instruments. Known for their cutting-edge technology and superior quality, Texas Instruments delivers top-of-the-line Bit-Slice Micro Processors that are perfect for a wide range of applications. From military-grade operations to everyday computing needs, this chip carrier package offers unmatched value and benefits. With maximum clock frequency of 22.22 MHz and wide external data bus width of 14, this product provides customers with the competitive edge they need to succeed in today's fast-paced tech environment. Trust Texas Instruments for all your microprocessor needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability to the product, making it suitable for harsh environments.

Surface Mount: YES

Ease of assembly and space-saving design makes this product convenient for modern electronic manufacturing processes.

Maximum Supply Voltage: 5.5 V

The high supply voltage tolerance allows for flexibility in power supply options.

Package Shape: SQUARE

Square shape enables efficient use of space and easier integration into circuit boards.

No. of Terminals: 68

Having a high number of terminals allows for a greater number of connections and functionalities.

Package Style (Meter): CHIP CARRIER

Chip carrier style enhances thermal performance and facilitates automated assembly processes.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

High operating temperature range makes the product suitable for industrial and military applications.

Minimum Operating Temperature: -55 °C

Wide temperature range enables operation in extreme cold conditions.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing of connections and signal paths.

Maximum Seated Height: 3.05 mm

Low seated height saves space and enables compact device designs.

Width: 24.13 mm

Compact width dimension allows for easy integration into various electronic systems.

External Data Bus Width: 14

Wide external data bus width enhances data processing capabilities and speed.

Maximum Clock Frequency: 22.22 MHz

High clock frequency enables fast and efficient operation of the microprocessor.

Length: 24.13 mm

Compact length dimension for space-saving integration in electronic systems.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliability in extreme environmental conditions.

Peripheral IC Type: BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

Advanced peripheral IC type provides enhanced processing capabilities and flexibility in programming.

Technology: TTL

TTL technology offers high-speed performance and reliability in digital circuits.

Terminal Form: NO LEAD

No-lead terminal form simplifies assembly processes and improves reliability.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with common power sources.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for dense packing of terminals and compact device designs.

Technical Specifications

Bit-Slice Micro Processors SNJ54AS890FD attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

Maximum Clock Frequency:

22.22 MHz

External Data Bus Width:

14

JESD-30 Code:

S-CQCC-N68

Length:

24.13 mm

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.13 mm

Trade Compliance

SNJ54AS890FD Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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