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SN74S481JQP4

Texas Instruments

SN74S481JQP4 by Texas Instruments

SN74S481JQP4 by Texas Instruments is a Bit-Slice Micro Processor with 48 terminals in an IN-LINE package. Operating temperature range is 0-70°C, suitable for commercial applications. Utilizes TTL technology and ceramic package material, ideal for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,209 parts In-Stock

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6,209

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Digiode

USA . 4,795 parts In-Stock

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4,795

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 614 parts In-Stock

1+ parts

$3.000

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614

$3.000

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AZTECH Wire

Italy . 343 parts In-Stock

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$14.181

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343

$14.181

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Corohmni

South Africa . 36 parts In-Stock

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$17.359

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36

$17.359

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Parana Technologies

USA . 795 parts In-Stock

1+ parts

$44.866

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795

$44.866

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ChromeModa Solutions

Germany . 5,589 parts In-Stock

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$50.411

100+ parts

$41.337

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5,589

$50.411

$41.337

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IDEA Electronic Components Group

UK . 232 parts In-Stock

1+ parts

$50.411

100+ parts

$47.890

1k+ parts

$45.370

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232

$50.411

$47.890

$45.370

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Corphita

USA . 1,892 parts In-Stock

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DigiPath Technology Company

USA . 1,586 parts In-Stock

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$45.451

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1,586

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$45.451

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Overview

Boost your electronics projects with the SN74S481JQP4 by Texas Instruments, a top-tier manufacturer known for their high-quality products. This bit-slice microprocessor is perfect for a wide range of applications, offering unmatched reliability and performance. With its ceramic package body material and 48 terminals, this IC provides superior value and benefits to customers looking for a dependable solution for their electronics needs. Trust Texas Instruments to deliver excellence in every product, including the SN74S481JQP4.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its excellent thermal conductivity, making it ideal for handling heat efficiently in microprocessors, ensuring optimal performance.

Package Shape: RECTANGULAR

A rectangular shape allows for efficient layout and placement within electronic devices, maximizing space utilization.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options and functionality, making this microprocessor versatile for various applications.

Package Style (Meter): IN-LINE

The in-line package style offers ease of installation and replacement in electronic systems, enhancing convenience during assembly or maintenance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this microprocessor can handle moderate to high heat levels, ensuring reliability in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C enables this microprocessor to function in cold environments without performance issues.

Terminal Position: QUAD

A quad terminal position allows for efficient signal routing and management, reducing signal interference and improving overall performance.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, this microprocessor is suitable for a wide range of consumer electronics and industrial equipment.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Being a bit-slice microprocessor, this product offers modular and expandable processing capabilities, making it a flexible and scalable solution for complex computing tasks.

Technology: TTL

Utilizing TTL technology ensures high-speed data processing and compatibility with a wide range of digital systems, enhancing overall performance and reliability.

Terminal Form: PIN/PEG

The pin/peg terminal form provides secure and reliable connections, reducing the risk of signal loss or disconnection during operation.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers precise and compact connectivity options, facilitating efficient circuit design and board layout.

Technical Specifications

Bit-Slice Micro Processors SN74S481JQP4 attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-XQIP-P48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

QIP

Package Equivalence Code:

QUIP48A,.6/.8

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SN74S481JQP4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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