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SNJ54AS888GB

Texas Instruments

SNJ54AS888GB by Texas Instruments

SNJ54AS888GB by Texas Instruments is a Bit-Slice Micro Processor with 8-bit external data bus width. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V, making it suitable for military-grade applications requiring high performance and reliability in harsh environments. The package style is grid array with a square shape and ceramic, metal-sealed cofired body material, featuring 68 terminals at a pitch of 2.54mm for easy integration into various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,085 parts In-Stock

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8,085

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Digiode

USA . 870 parts In-Stock

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870

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Distributors (Availability)

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AZTECH Wire

Italy . 375 parts In-Stock

1+ parts

$17.142

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375

$17.142

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One Stop Electronics

USA . 457 parts In-Stock

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$25.000

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457

$25.000

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Corohmni

South Africa . 3,025 parts In-Stock

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$27.818

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$27.818

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Parana Technologies

USA . 1,675 parts In-Stock

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$55.115

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1,675

$55.115

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ChromeModa Solutions

Germany . 1,840 parts In-Stock

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$61.927

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$50.780

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1,840

$61.927

$50.780

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IDEA Electronic Components Group

UK . 715 parts In-Stock

1+ parts

$61.927

100+ parts

$58.831

1k+ parts

$55.734

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715

$61.927

$58.831

$55.734

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Corphita

USA . 2,727 parts In-Stock

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2,727

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DigiPath Technology Company

USA . 2,121 parts In-Stock

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$55.833

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2,121

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$55.833

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Overview

Discover the cutting-edge SNJ54AS888GB by Texas Instruments, a premium quality Bit-Slice Micro Processor that delivers unparalleled performance and reliability. With a military-grade temperature rating and advanced TTL technology, this product is ideal for a wide range of applications. From aerospace to telecommunications, this processor offers value and efficiency to customers looking for superior processing power in a compact square package. Trust in Texas Instruments for top-notch innovation and experience the advantages of the SNJ54AS888GB today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material provides high durability and strong resistance to environmental factors, ensuring reliable performance in various conditions.

Maximum Supply Voltage: 5.5 V

This high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into circuit design.

No. of Terminals: 68

The high number of terminals provides ample connectivity options, enabling versatile usage and compatibility with different components.

Package Style (Meter): GRID ARRAY

The grid array package style simplifies the layout and assembly process, making it easier to integrate this microprocessor into circuit designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable and reliable performance even in demanding thermal conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for use in a wide range of environments, including extreme cold conditions.

Maximum Seated Height: 4.57 mm

The relatively low maximum seated height makes it easier to fit this microprocessor into compact spaces without sacrificing performance.

Width: 27.94 mm

The compact width of the microprocessor allows for space-efficient integration into circuit designs.

External Data Bus Width: 8

The wide external data bus width of 8 enables fast data transfer and efficient processing capabilities, making this microprocessor suitable for tasks that require high throughput.

Length: 27.94 mm

The compact length of the microprocessor complements its width, allowing for space-efficient integration into circuit layouts.

Temperature Grade: MILITARY

The military-grade temperature rating ensures durability and reliability in harsh operating conditions, making this microprocessor suitable for military or industrial applications.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

The bit-slice microprocessor design offers flexibility and scalability in computing tasks, making it a versatile choice for various applications.

Technology: TTL

The use of TTL technology provides high-speed and reliable digital signal processing capabilities, ensuring efficient performance in data processing tasks.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying integration into existing systems.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm allows for easy connection and integration with other components, enhancing the usability of this microprocessor.

Technical Specifications

Bit-Slice Micro Processors SNJ54AS888GB attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P68

Length:

27.94 mm

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

27.94 mm

Peripheral IC Type:

Trade Compliance

SNJ54AS888GB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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