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SN54AS895GB

Texas Instruments

SN54AS895GB by Texas Instruments

Texas Instruments SN54AS895GB is a Bit-Slice Micro Processor with 8-bit external data bus width. Operating at 4.5-5.5 V, it features MILITARY temperature grade and TTL technology. Ideal for applications requiring BIT-SLICE PROCESSOR and DIRECT MEMORY ADDRESS GENERATOR functionalities in military-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,891 parts In-Stock

1+ parts

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6,891

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Digiode

USA . 1,305 parts In-Stock

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1,305

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 568 parts In-Stock

1+ parts

$8.396

100+ parts

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568

$8.396

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One Stop Electronics

USA . 1,399 parts In-Stock

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$35.000

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1,399

$35.000

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Parana Technologies

USA . 904 parts In-Stock

1+ parts

$67.212

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904

$67.212

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Corohmni

South Africa . 2,634 parts In-Stock

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$69.881

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2,634

$69.881

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ChromeModa Solutions

Germany . 4,279 parts In-Stock

1+ parts

$75.519

100+ parts

$61.926

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4,279

$75.519

$61.926

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IDEA Electronic Components Group

UK . 1,614 parts In-Stock

1+ parts

$75.519

100+ parts

$71.743

1k+ parts

$67.967

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1,614

$75.519

$71.743

$67.967

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Corphita

USA . 2,250 parts In-Stock

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2,250

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DigiPath Technology Company

USA . 406 parts In-Stock

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$68.088

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406

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$68.088

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Overview

Unleash the power of cutting-edge technology with the SN54AS895GB by Texas Instruments. Crafted with the highest quality materials and precision engineering, this Bit-Slice Micro Processor offers unparalleled performance and reliability. Ideal for military-grade applications, this processor delivers seamless operation in extreme temperatures. Elevate your projects with the advanced capabilities and unmatched value that only Texas Instruments can provide. Experience innovation at its finest with the SN54AS895GB.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability for the micro processor, making it a long-lasting choice.

Maximum Supply Voltage: 5.5 V

Allows for a higher supply voltage, providing flexibility in power requirements for various applications.

Package Shape: SQUARE

Square shape helps in better placement and fitting within electronic devices, optimizing space utilization.

No. of Terminals: 68

With a high number of terminals, this micro processor can support multiple connections and functions efficiently.

Package Style (Meter): GRID ARRAY

Grid array package style ensures easy installation and soldering onto circuit boards, simplifying the manufacturing process.

Minimum Supply Voltage: 4.5 V

Lower minimum supply voltage allows for energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this micro processor can withstand harsh operating conditions without compromising performance.

Minimum Operating Temperature: -55 °C

Wide range of operating temperatures ensures the micro processor can be used in various environments, even in extreme cold conditions.

Terminal Position: PERPENDICULAR

Perpendicular terminal position facilitates easy connection and integration into electronic systems, allowing for efficient signal transmission.

Maximum Seated Height: 4.57 mm

Low seated height enables a compact design, suitable for applications where space is limited.

Width: 27.94 mm

Optimal width size for easy handling and placement within electronic devices, ensuring compatibility with standard design layouts.

External Data Bus Width: 8

With an 8-bit data bus width, this micro processor can process and transmit data efficiently, suitable for various computing tasks.

Length: 27.94 mm

Matching length with width provides a balanced form factor for easy integration and compatibility with existing electronic designs.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliability and performance in extreme conditions, making it suitable for rugged applications.

Peripheral IC Type: BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR

Inclusion of advanced peripheral IC types enhances the functionality and processing capabilities of this micro processor, making it versatile for a wide range of applications.

Technology: TTL

TTL technology offers reliable and fast operation, ensuring precise data processing and communication within electronic systems.

Terminal Form: PIN/PEG

PIN/PEG terminal form provides secure and stable connections, reducing the risk of signal interference or loss in data transmission.

Nominal Supply Voltage: 5 V

Stable and standard nominal supply voltage ensures consistent performance and compatibility with a wide range of electronic systems.

Terminal Pitch: 2.54 mm

With a standard terminal pitch, this micro processor can easily be integrated into existing circuit designs, offering convenience and compatibility.

Technical Specifications

Bit-Slice Micro Processors SN54AS895GB attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P68

Length:

27.94 mm

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27.94 mm

Trade Compliance

SN54AS895GB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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