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SN54AS887FK

Texas Instruments

SN54AS887FK by Texas Instruments

SN54AS887FK by Texas Instruments is a Bit-Slice Micro Processor with 8-bit external data bus width, operating b/w -55 to 125 °C. It features a ceramic, metal-sealed cofired package body material and comes in a square chip carrier style. Ideal for military applications requiring high reliability and performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,837 parts In-Stock

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3,837

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Digiode

USA . 490 parts In-Stock

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490

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Distributors (Availability)

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AZTECH Wire

Italy . 325 parts In-Stock

1+ parts

$9.253

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325

$9.253

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One Stop Electronics

USA . 994 parts In-Stock

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$30.000

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994

$30.000

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Parana Technologies

USA . 715 parts In-Stock

1+ parts

$43.836

100+ parts

$4,070.843

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$39.452

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715

$43.836

$4,070.843

$39.452

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Corohmni

South Africa . 3,117 parts In-Stock

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$45.665

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3,117

$45.665

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DigiPath Technology Company

USA . 1,239 parts In-Stock

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$48.269

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$44.407

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1,239

$48.269

$44.407

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ChromeModa Solutions

Germany . 1,426 parts In-Stock

1+ parts

$49.254

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$40.388

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1,426

$49.254

$40.388

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IDEA Electronic Components Group

UK . 813 parts In-Stock

1+ parts

$49.254

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$46.791

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$44.329

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813

$49.254

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$44.329

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Corphita

USA . 2,173 parts In-Stock

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2,173

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Overview

Unleash the power of cutting-edge technology with Texas Instruments' SN54AS887FK Bit-Slice Micro Processor. Crafted with precision and expertise, this military-grade peripheral IC offers unparalleled performance and reliability. Perfect for a wide range of applications, this chip carrier package is designed to elevate your projects to new heights. Say goodbye to limitations and hello to endless possibilities with the SN54AS887FK by Texas Instruments. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides excellent durability and thermal conductivity, ensuring reliability and efficient heat dissipation.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 5.5 V

Can handle a higher supply voltage, offering flexibility in power requirements.

Package Shape: SQUARE

Square shape is often more compact and efficient for space-constrained designs.

No. of Terminals: 68

Sufficient terminals for connectivity and functionality, offering versatility in circuit design.

Package Style (Meter): CHIP CARRIER

Chip carrier style provides protection and easy handling during assembly and maintenance.

Minimum Supply Voltage: 4.5 V

Can operate at a low supply voltage, saving energy and reducing power consumption.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for demanding environments.

Minimum Operating Temperature: -55 °C

Can function in extremely cold temperatures, offering robust performance in various conditions.

Terminal Position: QUAD

Quad terminal position allows for easier connection and integration with other components.

Maximum Seated Height: 2.03 mm

Low seated height facilitates a compact design and efficient use of space.

Width: 24.13 mm

Moderate width for balance between space efficiency and terminal accessibility.

External Data Bus Width: 8

Wide data bus width enhances data processing speed and capacity.

Length: 24.13 mm

Moderate length for balance between space efficiency and terminal accessibility.

Temperature Grade: MILITARY

Military-grade temperature rating ensures durability and reliability in harsh conditions.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Specifically designed for efficient processing of data, suitable for specialized applications.

Technology: TTL

TTL technology offers high-speed data processing capabilities for demanding tasks.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness and compliance with regulations.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for compatibility with a wide range of systems and devices.

Terminal Pitch: 1.27 mm

Standard terminal pitch for ease of connection and compatibility with standard sockets and connectors.

Technical Specifications

Bit-Slice Micro Processors SN54AS887FK attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-N68

Length:

24.13 mm

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC68,.95SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Bit-Slice Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

SN54AS887FK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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