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SN54S482FH

Texas Instruments

SN54S482FH by Texas Instruments

SN54S482FH by Texas Instruments is a Bit-Slice Micro Processor with 4-bit external data bus width. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V, making it suitable for military-grade applications requiring high performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,807 parts In-Stock

1+ parts

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3,807

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Digiode

USA . 3,340 parts In-Stock

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3,340

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 808 parts In-Stock

1+ parts

$18.419

100+ parts

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808

$18.419

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Parana Technologies

USA . 1,538 parts In-Stock

1+ parts

$18.993

100+ parts

-

1k+ parts

$19.052

10k+ parts

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1,538

$18.993

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$19.052

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IDEA Electronic Components Group

UK . 2,176 parts In-Stock

1+ parts

$21.341

100+ parts

$20.274

1k+ parts

$19.207

10k+ parts

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2,176

$21.341

$20.274

$19.207

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ChromeModa Solutions

Germany . 2,173 parts In-Stock

1+ parts

$21.341

100+ parts

$17.500

1k+ parts

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2,173

$21.341

$17.500

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One Stop Electronics

USA . 1,356 parts In-Stock

1+ parts

$23.000

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1,356

$23.000

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Corohmni

South Africa . 955 parts In-Stock

1+ parts

$80.818

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955

$80.818

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Corphita

USA . 2,877 parts In-Stock

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2,877

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DigiPath Technology Company

USA . 2,232 parts In-Stock

1+ parts

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$19.241

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2,232

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$19.241

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Overview

Unleash the power of cutting-edge technology with the SN54S482FH by Texas Instruments, a top-of-the-line Bit-Slice Micro Processor that sets the standard for quality and innovation in the industry. Designed to exceed expectations, this product offers unparalleled performance and reliability, making it ideal for a wide range of applications. From military-grade projects to commercial ventures, this chip carrier package delivers exceptional value, benefits, and advantages to customers seeking optimal solutions for their electronic needs. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Package Shape: SQUARE

Optimizes PCB real estate usage and allows for efficient component placement.

No. of Terminals: 20

Provides ample connection options for interfacing with other components or peripherals.

Package Style (Meter): CHIP CARRIER

Offers a compact form factor for space-constrained designs and improves thermal performance.

Minimum Supply Voltage: 4.5 V

Can operate at lower voltage levels, aiding in power efficiency and heat management.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for industrial or harsh environments.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold conditions, ensuring reliability in diverse environmental settings.

Terminal Position: QUAD

Facilitates easy connection and soldering of the component onto the PCB.

Maximum Seated Height: 2.54 mm

Allows for a low-profile design, enabling compact and sleek product form factors.

Width: 8.89 mm

Contributes to the overall compactness and space efficiency of the product.

External Data Bus Width: 4

Offers a sufficient data bus width for processing operations, ensuring smooth and efficient data management.

Length: 8.89 mm

Contributes to the overall compactness and space efficiency of the product.

Temperature Grade: MILITARY

Meets stringent military-grade specifications, ensuring high reliability and durability in harsh operating conditions.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Designed specifically for bit-slice processing tasks, offering optimized performance for relevant applications.

Technology: TTL

Utilizes TTL technology known for its reliability and low power consumption, enhancing the product's overall performance.

Terminal Form: NO LEAD

Enables lead-free soldering processes, complying with environmental regulations and reducing potential health hazards.

Nominal Supply Voltage: 5 V

Operates at the standard 5V voltage level, ensuring compatibility with a wide range of power sources and systems.

Terminal Pitch: 1.27 mm

Provides a suitable distance between terminals for easy soldering and interconnection, enhancing manufacturability.

Technical Specifications

Bit-Slice Micro Processors SN54S482FH attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

4

JESD-30 Code:

S-PQCC-N20

Length:

8.89 mm

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Peripheral IC Type:

Trade Compliance

SN54S482FH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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