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SN54S482J

Texas Instruments

SN54S482J by Texas Instruments

SN54S482J by Texas Instruments is a Bit-Slice Micro Processor with 20 terminals, operating b/w -55 to 125 °C. It features a 4-bit external data bus width and uses TTL technology. Ideal for military applications due to its MIL temperature grade and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,246 parts In-Stock

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8,246

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Digiode

USA . 3,830 parts In-Stock

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3,830

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Distributors (Availability)

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AZTECH Wire

Italy . 876 parts In-Stock

1+ parts

$7.396

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876

$7.396

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Parana Technologies

USA . 24 parts In-Stock

1+ parts

$22.031

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-

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$22.584

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24

$22.031

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$22.584

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DigiPath Technology Company

USA . 2,044 parts In-Stock

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$24.259

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2,044

$24.259

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IDEA Electronic Components Group

UK . 1,827 parts In-Stock

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$24.754

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$23.516

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$22.279

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1,827

$24.754

$23.516

$22.279

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ChromeModa Solutions

Germany . 669 parts In-Stock

1+ parts

$24.754

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$20.298

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669

$24.754

$20.298

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Corohmni

South Africa . 554 parts In-Stock

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$28.188

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554

$28.188

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One Stop Electronics

USA . 1,555 parts In-Stock

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$30.000

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Corphita

USA . 2,913 parts In-Stock

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2,913

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Overview

Unleash the power of cutting-edge technology with the SN54S482J by Texas Instruments. Crafted with precision and innovation, this bit-slice microprocessor offers unparalleled performance and reliability for a wide range of applications. From military-grade operations to industrial settings, this versatile component is designed to exceed expectations. Elevate your projects with the quality and expertise that only Texas Instruments can deliver. Experience the value and benefits of superior technology with the SN54S482J.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The unique material combination provides excellent durability and protection for the internal components of the microprocessor, ensuring long-lasting performance in various environments.

Maximum Supply Voltage: 5.5 V

Having a high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of voltage sources.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space and easy integration into electronic systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this microprocessor suitable for use in demanding environments where temperature fluctuations occur.

Technology: TTL

The use of TTL technology ensures reliable and efficient processing of data, providing accuracy and speed in computing tasks.

Technical Specifications

Bit-Slice Micro Processors SN54S482J attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

4

JESD-30 Code:

R-CDIP-T20

Length:

24.1935 mm

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bit-Slice Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

SN54S482J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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