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SN74S481N3

Texas Instruments

SN74S481N3 by Texas Instruments

SN74S481N3 by Texas Instruments is a Bit-Slice Micro Processor with 48 terminals in an IN-LINE package. Operating temperature range of 0-70°C, suitable for commercial applications. Utilizes TTL technology and features PIN/PEG terminal form at 1.27mm pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,921 parts In-Stock

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3,921

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Vyrian

USA . 2,605 parts In-Stock

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2,605

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Distributors (Availability)

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AZTECH Wire

Italy . 243 parts In-Stock

1+ parts

$15.864

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243

$15.864

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One Stop Electronics

USA . 826 parts In-Stock

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$35.000

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826

$35.000

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Parana Technologies

USA . 910 parts In-Stock

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$66.920

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910

$66.920

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DigiPath Technology Company

USA . 894 parts In-Stock

1+ parts

$73.687

100+ parts

$67.792

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894

$73.687

$67.792

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IDEA Electronic Components Group

UK . 1,305 parts In-Stock

1+ parts

$75.191

100+ parts

$71.431

1k+ parts

$67.672

10k+ parts

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1,305

$75.191

$71.431

$67.672

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ChromeModa Solutions

Germany . 269 parts In-Stock

1+ parts

$75.191

100+ parts

$61.657

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269

$75.191

$61.657

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Corohmni

South Africa . 46 parts In-Stock

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$79.468

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46

$79.468

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Corphita

USA . 1,131 parts In-Stock

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1,131

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Overview

Unleash the power of cutting-edge technology with the SN74S481N3 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in every product. The SN74S481N3 falls under the category of Bit-Slice Micro Processors, offering versatile applications in various industries. Experience seamless performance and efficiency with this product, providing unmatched value and benefits to customers. Upgrade your systems and elevate your projects with the SN74S481N3 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and resistant to damage, making the product long-lasting and reliable.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic systems and saves space.

No. of Terminals: 48

Having 48 terminals allows for a high level of connectivity and functionality in the product.

Package Style (Meter): IN-LINE

In-line package style makes it easy to install and connect with other components in a circuit.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can function effectively even in demanding environments.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures ensures the product's reliability in various conditions.

Terminal Position: QUAD

Quad terminal position allows for efficient signal flow and connectivity within the product.

Temperature Grade: COMMERCIAL

Commercial-grade temperature rating ensures the product is suitable for typical commercial applications.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Being a bit-slice microprocessor, it offers high performance and flexibility in handling complex computing tasks.

Technology: TTL

TTL technology provides reliable and fast digital signal processing capabilities for the product.

Terminal Form: PIN/PEG

Pin/peg terminal form allows for easy connections with other components, facilitating quick and convenient integration.

Terminal Pitch: 1.27 mm

With a small terminal pitch, the product can be densely packed, saving space and enabling compact designs.

Technical Specifications

Bit-Slice Micro Processors SN74S481N3 attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-PQIP-P48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QIP

Package Equivalence Code:

QUIP48A,.6/.8

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SN74S481N3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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