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SN74AS887GB

Texas Instruments

SN74AS887GB by Texas Instruments

SN74AS887GB by Texas Instruments is a Bit-Slice Micro Processor with 8-bit external data bus width, operating at 5V nominal voltage. It features a ceramic, metal-sealed cofired package body material and operates within a temperature range of 0 to 70°C. Ideal for applications requiring high-performance processing in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,495 parts In-Stock

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5,495

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Digiode

USA . 4,313 parts In-Stock

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4,313

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Distributors (Availability)

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One Stop Electronics

USA . 1,251 parts In-Stock

1+ parts

$12.000

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1,251

$12.000

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AZTECH Wire

Italy . 554 parts In-Stock

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$18.129

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554

$18.129

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Parana Technologies

USA . 1,959 parts In-Stock

1+ parts

$50.846

100+ parts

$4,721.794

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$45.761

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1,959

$50.846

$4,721.794

$45.761

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DigiPath Technology Company

USA . 1,265 parts In-Stock

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$55.987

100+ parts

$51.508

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1,265

$55.987

$51.508

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ChromeModa Solutions

Germany . 1,918 parts In-Stock

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$57.130

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$46.847

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1,918

$57.130

$46.847

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IDEA Electronic Components Group

UK . 1,373 parts In-Stock

1+ parts

$57.130

100+ parts

$54.274

1k+ parts

$51.417

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1,373

$57.130

$54.274

$51.417

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Corohmni

South Africa . 2,563 parts In-Stock

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$73.006

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Corphita

USA . 3,843 parts In-Stock

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3,843

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Overview

Experience unparalleled performance and reliability with the SN74AS887GB Bit-Slice Micro Processor by Texas Instruments. Crafted with precision using high-quality materials, this cutting-edge technology offers seamless integration and advanced functionality for a wide range of applications. Elevate your projects with the superior value, benefits, and advantages that only Texas Instruments can deliver. Trust in Texas Instruments to bring innovation to life and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection for the microprocessor, ensuring reliable performance even in harsh environmental conditions.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for versatility in power supply options, making it suitable for various applications.

Package Shape: SQUARE

The square shape allows for efficient use of space and easy integration into circuit designs.

No. of Terminals: 68

Having a high number of terminals enables connectivity to multiple external components, increasing the microprocessor's functionality.

Minimum Supply Voltage: 4.5 V

With a low minimum supply voltage, the microprocessor can operate efficiently even with limited power resources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance under temperature stress, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the microprocessor to function effectively in a wide range of environmental conditions.

Terminal Position: PERPENDICULAR

Perpendicular terminal positioning facilitates easy installation and connection in circuit boards, simplifying the assembly process.

Maximum Seated Height: 4.57 mm

The low seated height allows for compact designs and efficient use of space in electronic devices.

Width: 27.94 mm

The moderate width provides a balance between compactness and ease of integration into circuit layouts.

External Data Bus Width: 8

An 8-bit external data bus width allows for efficient data transfer and processing, enhancing the microprocessor's performance capabilities.

Length: 27.94 mm

The length dimension complements the width, making the microprocessor suitable for various form factors in electronic designs.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades makes this microprocessor suitable for standard commercial electronic applications.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

The bit-slice microprocessor design offers flexibility and scalability in processing tasks, making it versatile for a wide range of applications.

Technology: TTL

Using TTL technology ensures compatibility with standard TTL logic levels, facilitating integration with existing circuitry.

Terminal Form: PIN/PEG

The pin/peg terminal form provides multiple options for connecting the microprocessor, allowing for flexibility in circuit board design.

Nominal Supply Voltage: 5 V

With a standard 5V nominal supply voltage, this microprocessor is compatible with many common power sources, simplifying integration into electronic systems.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy connection to standard pitch components, streamlining the circuit assembly process.

Technical Specifications

Bit-Slice Micro Processors SN74AS887GB attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P68

Length:

27.94 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bit-Slice Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27.94 mm

Peripheral IC Type:

Trade Compliance

SN74AS887GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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