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SN74AS895-1GB

Texas Instruments

SN74AS895-1GB by Texas Instruments

SN74AS895-1GB by Texas Instruments is a Bit-Slice Micro Processor with 8-bit external data bus width. Operating at 4.5-5.5 V, it features TTL technology and a max temperature of 70°C. Ideal for applications requiring direct memory address generation in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,229 parts In-Stock

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3,229

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Vyrian

USA . 2,455 parts In-Stock

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2,455

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Distributors (Availability)

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One Stop Electronics

USA . 878 parts In-Stock

1+ parts

$12.000

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878

$12.000

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AZTECH Wire

Italy . 315 parts In-Stock

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$16.747

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315

$16.747

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Parana Technologies

USA . 1,557 parts In-Stock

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$21.420

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$21.772

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1,557

$21.420

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$21.772

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ChromeModa Solutions

Germany . 3,270 parts In-Stock

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$24.067

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$19.735

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3,270

$24.067

$19.735

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IDEA Electronic Components Group

UK . 110 parts In-Stock

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$24.067

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$22.864

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$21.660

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110

$24.067

$22.864

$21.660

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Corohmni

South Africa . 2,507 parts In-Stock

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$67.646

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2,507

$67.646

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Corphita

USA . 3,910 parts In-Stock

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3,910

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DigiPath Technology Company

USA . 1,687 parts In-Stock

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$21.699

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1,687

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$21.699

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Overview

Unleash the power of cutting-edge technology with the SN74AS895-1GB by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and performance in their Bit-Slice Micro Processors. Ideal for various applications, this product offers unmatched value and benefits to customers. Experience seamless operation and reliability with the SN74AS895-1GB, setting new standards in efficiency and innovation. Elevate your projects and achieve outstanding results with this exceptional product.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The package body material of ceramic and metal-sealed cofired provides excellent durability and reliability, making this product suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape ensures efficient use of space and can easily fit into standardized mounting configurations.

No. of Terminals: 68

Having 68 terminals allows for versatile connectivity options and integration with various peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style provides ease of assembly and reliability in mounting, ensuring stable connection of the microprocessor.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this microprocessor can withstand elevated temperatures and maintain performance under challenging conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable operation even in cold environments, making this microprocessor suitable for a wide range of applications.

Terminal Position: PERPENDICULAR

The perpendicular terminal position enables easy connection with other components and ensures secure and stable connections for efficient data transfer.

Width: 27.94 mm

With a width of 27.94 mm, this microprocessor can fit into compact spaces and is suitable for applications where size constraints are a concern.

External Data Bus Width: 8

The external data bus width of 8 allows for efficient data transmission and processing, enhancing the overall performance of the microprocessor.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures that this microprocessor is suitable for use in standard commercial applications with moderate temperature requirements.

Peripheral IC Type: BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR

The inclusion of a bit-slice processor and direct memory address generator as peripheral IC types enhances the functionality and capabilities of this microprocessor for advanced computing tasks.

Technology: TTL

Utilizing TTL technology ensures fast and reliable performance in digital circuits, making this microprocessor ideal for high-speed computing applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides a standard power input for the microprocessor, ensuring compatibility with common power sources.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm allows for easy connection and integration with standard connectors, facilitating installation and maintenance of the microprocessor.

Technical Specifications

Bit-Slice Micro Processors SN74AS895-1GB attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P68

Length:

27.94 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27.94 mm

Trade Compliance

SN74AS895-1GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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