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SNJ54S482J

Texas Instruments

SNJ54S482J by Texas Instruments

SNJ54S482J by Texas Instruments is a Bit-Slice Micro Processor with 20 terminals, TTL technology, and 4-bit external data bus width. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V. Ideal for military applications requiring high reliability and performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,491 parts In-Stock

1+ parts

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4,491

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Digiode

USA . 1,693 parts In-Stock

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1,693

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 410 parts In-Stock

1+ parts

$12.055

100+ parts

-

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410

$12.055

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One Stop Electronics

USA . 1,381 parts In-Stock

1+ parts

$24.000

100+ parts

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1,381

$24.000

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Corohmni

South Africa . 363 parts In-Stock

1+ parts

$46.646

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363

$46.646

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Parana Technologies

USA . 1,342 parts In-Stock

1+ parts

$69.602

100+ parts

$6,463.643

1k+ parts

$62.642

10k+ parts

-

1,342

$69.602

$6,463.643

$62.642

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DigiPath Technology Company

USA . 2,159 parts In-Stock

1+ parts

$76.641

100+ parts

$70.510

1k+ parts

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2,159

$76.641

$70.510

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ChromeModa Solutions

Germany . 6,713 parts In-Stock

1+ parts

$78.205

100+ parts

$64.128

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6,713

$78.205

$64.128

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IDEA Electronic Components Group

UK . 162 parts In-Stock

1+ parts

$78.205

100+ parts

$74.295

1k+ parts

$70.384

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162

$78.205

$74.295

$70.384

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Corphita

USA . 4,434 parts In-Stock

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4,434

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Overview

Unlock unparalleled performance and reliability with the Texas Instruments SNJ54S482J Bit-Slice Micro Processor. Crafted with precision using top-notch materials, this military-grade component offers seamless integration and superior functionality for a wide range of applications. With its compact design and advanced technology, this product delivers unmatched efficiency and dependability, making it the ideal choice for your next project. Elevate your performance with the SNJ54S482J from Texas Instruments today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed body material provides durability and protection for the microprocessor, making it suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for a wide range of input voltages, providing flexibility in power supply options.

Package Style (Meter): IN-LINE

The in-line package style makes the microprocessor easy to integrate into existing systems and circuit designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the microprocessor can perform reliably in demanding thermal conditions.

Technology: TTL

The TTL technology offers high-speed performance and compatibility with a wide range of other TTL-based components.

Technical Specifications

Bit-Slice Micro Processors SNJ54S482J attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

4

JESD-30 Code:

R-GDIP-T20

Length:

24.1935 mm

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Bit-Slice Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

SNJ54S482J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-115-2156, 5962011152156

NIIN

011152156

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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