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ADSP-1402SG/883B

Analog Devices

ADSP-1402SG/883B by Analog Devices

ADSP-1402SG/883B by Analog Devices is a MILITARY-grade Bit-Slice Micro Processor with 84 terminals in a CERAMIC package. Operating temperature ranges from -55 to 125 °C, suitable for applications requiring high reliability and performance in harsh environments. Ideal for BIT-SLICE PROCESSOR and MICROPROGRAM SEQUENCER peripheral IC types.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,851 parts In-Stock

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Digiode

USA . 355 parts In-Stock

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355

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Semicontronic

India . 1,313 parts In-Stock

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$5.000

100+ parts

$4.875

1k+ parts

$4.850

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1,313

$5.000

$4.875

$4.850

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AZTECH Wire

Italy . 528 parts In-Stock

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$16.930

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528

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Parana Technologies

USA . 1,154 parts In-Stock

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$22.721

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$21.130

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$22.721

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$21.130

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IDEA Electronic Components Group

UK . 1,628 parts In-Stock

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$24.431

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$23.209

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Native Components

USA . 134 parts In-Stock

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$25.616

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Northwest PG Solutions

USA . 1,066 parts In-Stock

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$28.178

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$25.360

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$28.178

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One Stop Electronics

USA . 1,543 parts In-Stock

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$32.000

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Corohmni

South Africa . 520 parts In-Stock

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$36.317

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520

$36.317

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DigiPath Technology Company

USA . 534 parts In-Stock

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$38.112

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$36.588

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$36.588

534

$38.112

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$36.588

Corphita

USA . 162 parts In-Stock

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Overview

Experience top-notch performance and reliability with the ADSP-1402SG/883B by Analog Devices, a leading manufacturer in the industry. This Bit-Slice Micro Processor offers unparalleled value with its military-grade quality and versatile applications. Whether you're working on defense systems or industrial automation, this product's advanced technology and high operating temperature range ensure optimal functionality in any environment. Trust Analog Devices to deliver cutting-edge solutions that exceed your expectations. Elevate your projects with the ADSP-1402SG/883B today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and mechanical strength, making them ideal for high-reliability applications.

Screening Level: 38535Q/M;38534H;883B

This high screening level ensures that the product meets stringent military standards for reliability and performance.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy mounting.

No. of Terminals: 84

With a high number of terminals, this bit-slice microprocessor offers versatile connectivity options for various applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides high density and reliability for complex circuit designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microprocessor can withstand demanding environmental conditions.

Minimum Operating Temperature: -55 °C

The wide range of operating temperatures allows this product to be used in extreme environments without any issues.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and conductivity for reliable connections.

Terminal Position: PERPENDICULAR

The perpendicular terminal position makes it easier to mount and connect the microprocessor in the circuit.

Temperature Grade: MILITARY

Being military-grade ensures that this microprocessor meets strict quality and reliability standards required for critical applications.

Peripheral IC Type: BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

The combination of bit-slice processor and microprogram sequencer offers powerful processing capabilities and flexibility in programming.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation for efficient performance.

Terminal Form: PIN/PEG

The pin/peg terminal form allows for easy insertion and soldering, enabling quick and secure connections.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54mm, this microprocessor can be easily integrated into existing circuit designs and breadboards.

Technical Specifications

Bit-Slice Micro Processors ADSP-1402SG/883B attributes and parameters. Explore more Bit-Slice Micro Processors devices from Analog Devices

Specs

JESD-30 Code:

S-XPGA-P84

JESD-609 Code:

e0

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA84M,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

ADSP-1402SG/883B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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