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ADSP-1401TN/883B

Analog Devices

ADSP-1401TN/883B by Analog Devices

ADSP-1401TN/883B by Analog Devices is a MILITARY-grade Bit-Slice Micro Processor with 16-bit External Data Bus Width. It operates b/w -55 to 125 °C and features a RECTANGULAR package style with 48 terminals. Ideal for applications requiring high-performance microprogram sequencing in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,507 parts In-Stock

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Digiode

USA . 864 parts In-Stock

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Native Components

USA . 544 parts In-Stock

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$1.558

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Northwest PG Solutions

USA . 1,907 parts In-Stock

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$1.714

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AZTECH Wire

Italy . 538 parts In-Stock

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Semicontronic

India . 1,447 parts In-Stock

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$25.000

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$24.375

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$24.250

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One Stop Electronics

USA . 170 parts In-Stock

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Parana Technologies

USA . 1,757 parts In-Stock

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$32.437

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$30.166

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IDEA Electronic Components Group

UK . 2,201 parts In-Stock

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$34.878

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Corohmni

South Africa . 621 parts In-Stock

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DigiPath Technology Company

USA . 575 parts In-Stock

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$54.410

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Corphita

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Overview

Unlock the power of cutting-edge technology with the ADSP-1401TN/883B by Analog Devices. As a leader in the industry, Analog Devices delivers top-quality bit-slice microprocessors that cater to a wide range of applications. From military-grade operations to consumer electronics, the ADSP-1401TN/883B offers unparalleled performance and reliability. With its advanced features and innovative design, this product provides customers with exceptional value and unmatched benefits. Experience the difference with Analog Devices today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy is a common and reliable material for packaging electronic components, providing good protection against environmental factors.

No. of Terminals: 48

Having 48 terminals allows for sufficient connectivity options and integration with other components.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the processor efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are easy to solder onto PCBs, ensuring secure connections.

Technical Specifications

Bit-Slice Micro Processors ADSP-1401TN/883B attributes and parameters. Explore more Bit-Slice Micro Processors devices from Analog Devices

Specs

External Data Bus Width:

16

JESD-30 Code:

R-PDIP-T48

JESD-609 Code:

e0

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

ADSP-1401TN/883B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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