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SN74S482FN

Texas Instruments

SN74S482FN by Texas Instruments

SN74S482FN by Texas Instruments is a Bit-Slice Micro Processor with 20 terminals, TTL technology, and 4-bit external data bus width. It operates b/w 0-70°C and has a supply voltage range of 4.75-5.25 V. Ideal for commercial applications requiring high-performance microprocessors in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,849 parts In-Stock

1+ parts

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100+ parts

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3,849

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Digiode

USA . 3,157 parts In-Stock

1+ parts

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100+ parts

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3,157

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,374 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,374

$5.000

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AZTECH Wire

Italy . 883 parts In-Stock

1+ parts

$9.954

100+ parts

-

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883

$9.954

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Corohmni

South Africa . 267 parts In-Stock

1+ parts

$24.577

100+ parts

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267

$24.577

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Parana Technologies

USA . 2,105 parts In-Stock

1+ parts

$71.170

100+ parts

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10k+ parts

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2,105

$71.170

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DigiPath Technology Company

USA . 483 parts In-Stock

1+ parts

$78.367

100+ parts

$72.097

1k+ parts

-

10k+ parts

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483

$78.367

$72.097

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ChromeModa Solutions

Germany . 4,278 parts In-Stock

1+ parts

$79.966

100+ parts

$65.572

1k+ parts

-

10k+ parts

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4,278

$79.966

$65.572

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IDEA Electronic Components Group

UK . 405 parts In-Stock

1+ parts

$79.966

100+ parts

$75.968

1k+ parts

$71.969

10k+ parts

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405

$79.966

$75.968

$71.969

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Corphita

USA . 3,880 parts In-Stock

1+ parts

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3,880

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Overview

Experience unparalleled performance and reliability with the SN74S482FN by Texas Instruments, a leading manufacturer known for top-quality products. This Bit-Slice Micro Processor offers cutting-edge technology in a compact package, making it ideal for a wide range of applications. From industrial automation to telecommunications, this chip carrier provides customers with superior value, efficiency, and functionality. Trust Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product more affordable for consumers.

Surface Mount: YES

Allows for easy installation on a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage inputs, providing flexibility in power supply requirements.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board, optimizing layout and design.

No. of Terminals: 20

Sufficient number of terminals for connecting to other components, ensuring compatibility and versatility.

Minimum Supply Voltage: 4.75 V

Provides a wide operating range for power supply, accommodating different voltage levels.

Maximum Operating Temperature: 70 °C

Can operate in high temperature environments, suitable for a variety of applications.

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments, allowing for use in diverse conditions.

Terminal Position: QUAD

Quad terminal position provides stability and secure connection on the circuit board.

Maximum Seated Height: 4.57 mm

Low seated height minimizes the overall height of the product, saving space in compact designs.

Width: 8.9662 mm

Compact width size makes it suitable for small electronic devices, enabling efficient use of space.

External Data Bus Width: 4

Optimal data bus width for efficient data transfer and processing capabilities.

Length: 8.9662 mm

Compact length size makes it suitable for small electronic devices, enabling efficient use of space.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications, ensuring compatibility with most electronic systems.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Specialized IC type designed for efficient processing and control functions, suitable for specific applications.

Technology: TTL

TTL technology offers reliable and fast performance, enhancing the overall efficiency of the product.

Terminal Form: J BEND

J bend terminals provide secure and reliable connections on the circuit board, reducing the risk of disconnection.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage ensures compatibility with most power sources.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy connection to the circuit board, facilitating installation and maintenance.

Technical Specifications

Bit-Slice Micro Processors SN74S482FN attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

4

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Peripheral IC Type:

Trade Compliance

SN74S482FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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