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SN74AS895FN

Texas Instruments

SN74AS895FN by Texas Instruments

SN74AS895FN by Texas Instruments is a Bit-Slice Micro Processor with 8-bit external data bus width and TTL technology. It operates b/w 0-70°C, has a supply voltage range of 4.5-5.5V, and comes in a square chip carrier package style. Ideal for applications requiring direct memory address generation in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,892 parts In-Stock

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3,892

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Digiode

USA . 3,189 parts In-Stock

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3,189

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Distributors (Availability)

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AZTECH Wire

Italy . 609 parts In-Stock

1+ parts

$14.261

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609

$14.261

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One Stop Electronics

USA . 1,561 parts In-Stock

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$25.000

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1,561

$25.000

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Corohmni

South Africa . 960 parts In-Stock

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$31.471

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960

$31.471

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Parana Technologies

USA . 1,797 parts In-Stock

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$73.300

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1,797

$73.300

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DigiPath Technology Company

USA . 1,213 parts In-Stock

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$80.713

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$74.256

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1,213

$80.713

$74.256

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IDEA Electronic Components Group

UK . 1,597 parts In-Stock

1+ parts

$82.360

100+ parts

$78.242

1k+ parts

$74.124

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1,597

$82.360

$78.242

$74.124

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ChromeModa Solutions

Germany . 208 parts In-Stock

1+ parts

$82.360

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$67.535

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208

$82.360

$67.535

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Corphita

USA . 1,831 parts In-Stock

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Overview

Elevate your electronics projects with the SN74AS895FN by Texas Instruments, a top-tier manufacturer known for quality and innovation. This bit-slice microprocessor offers unparalleled performance and reliability, making it ideal for a wide range of applications. With its advanced technology and efficient design, this chip carrier package provides customers with seamless integration and optimal functionality. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to heat, making the product robust and reliable.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power input options, ensuring compatibility with a wide range of systems.

Package Shape: SQUARE

Optimal shape for efficient use of space on circuit boards, maximizing component density.

No. of Terminals: 68

Offers a sufficient number of connection points for versatile integration with other components.

Package Style (Meter): CHIP CARRIER

Enhances heat dissipation and protects the delicate internals, extending the product's lifespan.

Minimum Supply Voltage: 4.5 V

Allows for operation in low-power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 70 °C

Ensures stable performance even in high-temperature environments, enhancing reliability.

Minimum Operating Temperature: 0 °C

Capable of functioning in cold conditions, making it suitable for various operating environments.

Terminal Position: QUAD

Facilitates easy connection and arrangement of the terminals, improving ease of use.

Maximum Seated Height: 4.57 mm

Compact height enables efficient stacking of components, optimizing space usage.

Width: 24.2062 mm

Balanced width dimension for effective placement and alignment within circuit board layouts.

External Data Bus Width: 8

Wide data bus width enhances data processing speed and efficiency, improving overall performance.

Length: 24.2062 mm

Balanced length dimension for effective placement and alignment within circuit board layouts.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications, meeting industry standards and requirements.

Peripheral IC Type: BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR

Equipped with advanced IC types for enhanced processing capabilities and data management functions.

Technology: TTL

Utilizes reliable TTL technology for efficient and accurate data processing, ensuring high performance.

Terminal Form: J BEND

J bend terminals provide secure connections and ease of insertion into circuit boards.

Nominal Supply Voltage: 5 V

Stable supply voltage for consistent performance and reliable operation under normal conditions.

Terminal Pitch: 1.27 mm

Optimal terminal spacing for easy assembly and placement on circuit boards, reducing the risk of errors.

Technical Specifications

Bit-Slice Micro Processors SN74AS895FN attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.2062 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.2062 mm

Trade Compliance

SN74AS895FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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