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SN74S481JQ

Texas Instruments

SN74S481JQ by Texas Instruments

SN74S481JQ by Texas Instruments is a Bit-Slice Micro Processor with 48 terminals in an IN-LINE package. Operating temperature range of 0-70°C, suitable for commercial applications. Utilizes TTL technology and ceramic package material, ideal for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,382 parts In-Stock

1+ parts

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2,382

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Digiode

USA . 106 parts In-Stock

1+ parts

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106

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 693 parts In-Stock

1+ parts

$5.618

100+ parts

-

1k+ parts

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10k+ parts

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693

$5.618

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One Stop Electronics

USA . 1,522 parts In-Stock

1+ parts

$29.000

100+ parts

-

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1,522

$29.000

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Corohmni

South Africa . 860 parts In-Stock

1+ parts

$48.679

100+ parts

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860

$48.679

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Parana Technologies

USA . 1,015 parts In-Stock

1+ parts

$61.955

100+ parts

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1,015

$61.955

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DigiPath Technology Company

USA . 282 parts In-Stock

1+ parts

$68.220

100+ parts

-

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282

$68.220

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ChromeModa Solutions

Germany . 640 parts In-Stock

1+ parts

$69.612

100+ parts

$57.082

1k+ parts

-

10k+ parts

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640

$69.612

$57.082

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IDEA Electronic Components Group

UK . 604 parts In-Stock

1+ parts

$69.612

100+ parts

$66.131

1k+ parts

$62.651

10k+ parts

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604

$69.612

$66.131

$62.651

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Corphita

USA . 1,590 parts In-Stock

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1,590

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Overview

Get ready to elevate your projects with the SN74S481JQ by Texas Instruments! Known for their top-quality manufacturing, Texas Instruments brings you a cutting-edge Bit-Slice Micro Processor that is perfect for a wide range of applications. With a ceramic package body and 48 terminals, this product offers reliability and durability. Whether you're working on industrial automation or telecommunications, this IC type microprocessor will exceed your expectations. Upgrade your designs and experience seamless performance with the SN74S481JQ today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers excellent thermal conductivity and high temperature resistance, making this product suitable for applications that require reliable performance in harsh operating environments.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient PCB layout and space-saving design, making it ideal for compact electronic devices.

No. of Terminals: 48

A higher number of terminals allow for more connectivity options and functionality, enhancing the versatility of this microprocessor in various applications.

Technology: TTL

TTL (Transistor-Transistor Logic) technology is known for its fast switching speeds and low power consumption, making this microprocessor suitable for high-performance applications while maintaining energy efficiency.

Technical Specifications

Bit-Slice Micro Processors SN74S481JQ attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-XQIP-P48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

QIP

Package Equivalence Code:

QUIP48A,.6/.8

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SN74S481JQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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