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SN74AS888GB

Texas Instruments

SN74AS888GB by Texas Instruments

SN74AS888GB by Texas Instruments is a Bit-Slice Micro Processor with 8-bit external data bus width, operating at 5V nominal voltage. It features a max supply voltage of 5.5V and operates in commercial temperature grade (0-70°C). Ideal for applications requiring high-speed processing and reliability in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,709 parts In-Stock

1+ parts

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7,709

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Digiode

USA . 1,057 parts In-Stock

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1,057

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,311 parts In-Stock

1+ parts

$6.000

100+ parts

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1,311

$6.000

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AZTECH Wire

Italy . 872 parts In-Stock

1+ parts

$6.357

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872

$6.357

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Corohmni

South Africa . 4 parts In-Stock

1+ parts

$41.852

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4

$41.852

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Parana Technologies

USA . 989 parts In-Stock

1+ parts

$69.512

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989

$69.512

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DigiPath Technology Company

USA . 768 parts In-Stock

1+ parts

$76.541

100+ parts

$70.418

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768

$76.541

$70.418

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ChromeModa Solutions

Germany . 2,510 parts In-Stock

1+ parts

$78.103

100+ parts

$64.044

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2,510

$78.103

$64.044

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IDEA Electronic Components Group

UK . 1,759 parts In-Stock

1+ parts

$78.103

100+ parts

$74.198

1k+ parts

$70.293

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1,759

$78.103

$74.198

$70.293

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Corphita

USA . 1,701 parts In-Stock

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1,701

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Overview

Unlock the power of cutting-edge technology with Texas Instruments' SN74AS888GB Bit-Slice Micro Processor. This high-quality product offers unparalleled performance and reliability, making it perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile processor delivers value, efficiency, and innovation. Trust Texas Instruments to provide you with the best in semiconductor solutions. Experience the difference with the SN74AS888GB and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability for the product, ensuring it can withstand harsh operating conditions.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage allows for flexibility in power input options, making it suitable for a wider range of applications.

Package Shape: SQUARE

The square shape makes it easier to design and integrate into circuit boards, optimizing space efficiency.

No. of Terminals: 68

Having 68 terminals provides ample connectivity options for various components, enhancing the product's versatility.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature tolerance ensures reliable performance even in cold environments.

Maximum Seated Height: 4.57 mm

The compact seated height allows for easy integration into slim devices or systems with height constraints.

External Data Bus Width: 8

The 8-bit external data bus width allows for efficient data processing and transfer speeds, enhancing overall performance.

Technology: TTL

TTL technology offers high-speed operation and low power consumption, making the product energy-efficient and capable of handling complex tasks.

Technical Specifications

Bit-Slice Micro Processors SN74AS888GB attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P68

Length:

27.94 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bit-Slice Processors

Maximum Supply Current:

520 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27.94 mm

Peripheral IC Type:

Trade Compliance

SN74AS888GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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