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SN74S482NP3

Texas Instruments

SN74S482NP3 by Texas Instruments

SN74S482NP3 by Texas Instruments is a Bit-Slice Micro Processor with 20 terminals in an IN-LINE package. Operating temperature range is 0-70°C, suitable for commercial applications. Utilizes TTL technology and through-hole terminal form, ideal for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,937 parts In-Stock

1+ parts

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8,937

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Digiode

USA . 3,887 parts In-Stock

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3,887

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 854 parts In-Stock

1+ parts

$13.130

100+ parts

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854

$13.130

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One Stop Electronics

USA . 354 parts In-Stock

1+ parts

$16.000

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354

$16.000

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Parana Technologies

USA . 2,112 parts In-Stock

1+ parts

$56.976

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2,112

$56.976

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DigiPath Technology Company

USA . 1,541 parts In-Stock

1+ parts

$62.738

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1,541

$62.738

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ChromeModa Solutions

Germany . 4,550 parts In-Stock

1+ parts

$64.018

100+ parts

$52.495

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4,550

$64.018

$52.495

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IDEA Electronic Components Group

UK . 196 parts In-Stock

1+ parts

$64.018

100+ parts

$60.817

1k+ parts

$57.616

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196

$64.018

$60.817

$57.616

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Corohmni

South Africa . 4,947 parts In-Stock

1+ parts

$80.361

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4,947

$80.361

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Corphita

USA . 3,739 parts In-Stock

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3,739

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Overview

Elevate your electronic designs with the SN74S482NP3 by Texas Instruments, a top-tier manufacturer known for delivering high-quality Bit-Slice Micro Processors. This innovative product offers unmatched reliability and precision, making it ideal for a wide range of applications. From automotive to industrial automation, this versatile component ensures seamless performance and efficiency. Trust Texas Instruments to provide value-driven solutions that exceed expectations and elevate your projects to new heights. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection to the components inside, making the product more reliable and long-lasting.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices and PCB designs, maximizing space efficiency.

No. of Terminals: 20

Having 20 terminals allows for a sufficient number of connections to other components, enabling advanced functionality and connectivity.

Package Style (Meter): IN-LINE

In-line package style simplifies the installation and maintenance process, making it user-friendly for technicians and engineers.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand heat stress and operate efficiently even in demanding environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in colder conditions, providing versatility in various temperature settings.

Terminal Position: DUAL

Dual terminal positions offer redundancy and flexibility in connection options, enhancing the product's reliability and adaptability.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets standard temperature requirements for everyday applications in industries and businesses.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Being a bit-slice microprocessor, this product offers high performance, efficiency, and versatility in processing data and executing tasks.

Technology: TTL

Using TTL technology ensures fast and reliable performance, making the product suitable for applications requiring high-speed data processing.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and ease of soldering during assembly, ensuring a secure and robust installation.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, the product is compatible with common PCB layouts and components, facilitating easy integration and replacement.

Technical Specifications

Bit-Slice Micro Processors SN74S482NP3 attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74S482NP3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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