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SN74AS888-1FN

Texas Instruments

SN74AS888-1FN by Texas Instruments

SN74AS888-1FN by Texas Instruments is a Bit-Slice Micro Processor with 8-bit external data bus width, operating at 4.5V to 5.5V. It comes in a square chip carrier package style with 68 terminals and J bend terminal form. Ideal for commercial applications requiring TTL technology and a max supply current of 520mA at temperatures ranging from 0°C to 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,461 parts In-Stock

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Digiode

USA . 416 parts In-Stock

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AZTECH Wire

Italy . 240 parts In-Stock

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$8.811

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$8.811

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One Stop Electronics

USA . 586 parts In-Stock

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$20.000

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Corohmni

South Africa . 5,109 parts In-Stock

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$46.369

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Parana Technologies

USA . 1,308 parts In-Stock

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$72.586

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DigiPath Technology Company

USA . 571 parts In-Stock

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$79.926

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ChromeModa Solutions

Germany . 5,822 parts In-Stock

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$81.557

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$66.877

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IDEA Electronic Components Group

UK . 558 parts In-Stock

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$81.557

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$77.479

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$73.401

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Corphita

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SN74AS888-1FN Bit-Slice Micro Processor. Proudly manufactured by a trusted industry leader, this innovative chip offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with exceptional value, efficiency, and performance. Experience the advantage of advanced technology with the SN74AS888-1FN and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the micro processor, ensuring a longer lifespan.

Surface Mount: YES

The surface mount capability makes installation and soldering easier and more efficient.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of operating conditions without risking damage to the processor.

Package Shape: SQUARE

The square shape allows for easier handling and placement within circuit boards.

No. of Terminals: 68

Provides ample connectivity options for integration with other components and devices.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for compact and efficient packaging of the micro processor.

Minimum Supply Voltage: 4.5 V

Ensures that the processor can operate efficiently even at lower voltage levels.

Maximum Operating Temperature: 70 °C

Allows for reliable operation in a variety of environments and conditions.

Minimum Operating Temperature: 0 °C

Can withstand colder temperatures without impacting performance.

Terminal Position: QUAD

The quad terminal position allows for easier connectivity and flexibility in circuit design.

Maximum Seated Height: 4.57 mm

The low profile design helps in minimizing overall system height and space requirements.

Width: 24.2062 mm

A compact width allows for efficient placement on circuit boards with limited space.

External Data Bus Width: 8

Provides a wider data bus for faster communication and data processing capabilities.

Length: 24.2062 mm

Similar to width, the compact length allows for efficient use of space on circuit boards.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where standard operating temperatures are expected.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Designed specifically for bit-slice processing, offering specialized functionality for certain applications.

Technology: TTL

TTL technology provides reliable and efficient logic operations for the micro processor.

Terminal Form: J BEND

The J bend terminal form allows for secure and stable connections within the circuit.

Maximum Supply Current: 520 mA

Capable of handling higher current requirements for more demanding operations.

Nominal Supply Voltage: 5 V

The nominal supply voltage ensures stable and consistent power delivery to the processor.

Terminal Pitch: 1.27 mm

The compact terminal pitch allows for high density integration on circuit boards.

Technical Specifications

Bit-Slice Micro Processors SN74AS888-1FN attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.2062 mm

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bit-Slice Processors

Maximum Supply Current:

520 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.2062 mm

Peripheral IC Type:

Trade Compliance

SN74AS888-1FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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