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SBP0401ACJ

Texas Instruments

SBP0401ACJ by Texas Instruments

Texas Instruments SBP0401ACJ is a 40-terminal bit-slice microprocessor with ceramic package. Operating temp range: 0-70°C, tech: bipolar. Ideal for commercial applications requiring high-performance processing in an inline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,795 parts In-Stock

1+ parts

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4,795

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Digiode

USA . 2,405 parts In-Stock

1+ parts

-

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2,405

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 157 parts In-Stock

1+ parts

$13.000

100+ parts

-

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157

$13.000

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AZTECH Wire

Italy . 608 parts In-Stock

1+ parts

$14.329

100+ parts

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608

$14.329

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Parana Technologies

USA . 1,719 parts In-Stock

1+ parts

$46.341

100+ parts

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1,719

$46.341

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ChromeModa Solutions

Germany . 1,252 parts In-Stock

1+ parts

$52.069

100+ parts

$42.697

1k+ parts

-

10k+ parts

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1,252

$52.069

$42.697

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IDEA Electronic Components Group

UK . 256 parts In-Stock

1+ parts

$52.069

100+ parts

$49.466

1k+ parts

$46.862

10k+ parts

-

256

$52.069

$49.466

$46.862

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Corohmni

South Africa . 4,861 parts In-Stock

1+ parts

$81.949

100+ parts

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4,861

$81.949

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Corphita

USA . 2,731 parts In-Stock

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2,731

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DigiPath Technology Company

USA . 1,867 parts In-Stock

1+ parts

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100+ parts

$46.945

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1,867

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$46.945

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Overview

Upgrade your electronic devices with the SBP0401ACJ Bit-Slice Micro Processor by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments brings you a versatile product suitable for a wide range of applications. With its ceramic package body and dual terminal position, this processor offers exceptional performance and durability. Experience seamless operation and enhanced functionality with the SBP0401ACJ, providing you with unparalleled value and benefits for all your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and high resistance to temperature changes, making them ideal for high-performance applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a PCB and easy integration into existing designs.

No. of Terminals: 40

Having a higher number of terminals allows for more connectivity options and flexibility in circuit design.

Package Style (Meter): IN-LINE

In-line package style allows for easy placement and routing of connections, reducing the risk of signal interference.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand demanding conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in colder environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal integrity, minimizing the risk of connection failures.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating environments, making it suitable for a wide range of applications.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Bit-slice microprocessors offer modular design and scalability, allowing for cost-effective customization and performance optimization.

Technology: BIPOLAR

Bipolar technology provides fast operation and high accuracy, making it suitable for real-time processing and control applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure and reliable connections, reducing the risk of signal loss or damage during assembly or operation.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration with common PCB layouts and components, simplifying the design and assembly process.

Technical Specifications

Bit-Slice Micro Processors SBP0401ACJ attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SBP0401ACJ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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