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SN54AS888FK

Texas Instruments

SN54AS888FK by Texas Instruments

SN54AS888FK by Texas Instruments is a Bit-Slice Micro Processor with 8-bit external data bus width, operating b/w -55 to 125 °C. It features a ceramic, metal-sealed cofired package body material and comes in a square chip carrier style. Ideal for military-grade applications requiring high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,145 parts In-Stock

1+ parts

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1k+ parts

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2,145

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Digiode

USA . 1,588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,588

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$10.668

100+ parts

-

1k+ parts

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10k+ parts

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762

$10.668

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Parana Technologies

USA . 234 parts In-Stock

1+ parts

$29.603

100+ parts

-

1k+ parts

$61.118

10k+ parts

-

234

$29.603

-

$61.118

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IDEA Electronic Components Group

UK . 1,192 parts In-Stock

1+ parts

$33.262

100+ parts

$31.599

1k+ parts

$29.936

10k+ parts

-

1,192

$33.262

$31.599

$29.936

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ChromeModa Solutions

Germany . 647 parts In-Stock

1+ parts

$33.262

100+ parts

$27.275

1k+ parts

-

10k+ parts

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647

$33.262

$27.275

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One Stop Electronics

USA . 1,093 parts In-Stock

1+ parts

$34.000

100+ parts

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1,093

$34.000

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Corohmni

South Africa . 500 parts In-Stock

1+ parts

$47.251

100+ parts

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500

$47.251

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Corphita

USA . 2,780 parts In-Stock

1+ parts

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2,780

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DigiPath Technology Company

USA . 2,184 parts In-Stock

1+ parts

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100+ parts

$29.989

1k+ parts

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10k+ parts

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2,184

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$29.989

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Overview

Unleash the power of cutting-edge technology with the SN54AS888FK by Texas Instruments, a top-tier manufacturer known for their superior quality and reliability. This bit-slice microprocessor is designed to elevate your electronic projects to new heights, offering unmatched performance and efficiency. From military-grade applications to industrial settings, this chip carrier package ensures seamless integration and optimal functionality. Experience the value and benefits that only Texas Instruments can provide, with the SN54AS888FK leading the way in innovation and excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides a high level of durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, offering flexibility in various applications.

Package Shape: SQUARE

Square shape helps in efficient space utilization on the PCB layout.

No. of Terminals: 68

Provides ample connectivity options for interfacing with other components or peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good heat dissipation and protection for the sensitive microprocessor.

Minimum Supply Voltage: 4.5 V

Ensures stable operation even at lower voltage levels, enhancing overall reliability.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and military applications.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold environments without performance degradation.

Terminal Position: QUAD

Quad terminal arrangement simplifies the assembly process and improves signal integrity.

Maximum Seated Height: 2.03 mm

Low profile design saves space and enables compact electronic device designs.

Width: 24.13 mm

Compact width dimension allows for efficient PCB layout and space-saving designs.

External Data Bus Width: 8

8-bit data bus width enables efficient data transfer and processing capabilities.

Length: 24.13 mm

Compact length dimension contributes to space-saving design considerations.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure ruggedness and reliability in harsh environments.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Advanced bit-slice microprocessor technology offers high performance computing capabilities.

Technology: TTL

TTL technology provides reliable and fast digital signal processing for various applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures product sustainability.

Nominal Supply Voltage: 5 V

Standard 5V nominal supply voltage makes it compatible with a wide range of electronic systems.

Terminal Pitch: 1.27 mm

Fine terminal pitch facilitates easy soldering and assembly, enhancing manufacturing efficiency.

Technical Specifications

Bit-Slice Micro Processors SN54AS888FK attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-N68

Length:

24.13 mm

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

SN54AS888FK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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