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SN74LS481N1

Texas Instruments

SN74LS481N1 by Texas Instruments

SN74LS481N1 by Texas Instruments is a Bit-Slice Micro Processor with 48 terminals in an IN-LINE package. Operating temperature range is 0-70°C, suitable for commercial-grade applications. Utilizes TTL technology and through-hole terminal form, ideal for various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,666 parts In-Stock

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4,666

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Digiode

USA . 3,256 parts In-Stock

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3,256

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 580 parts In-Stock

1+ parts

$15.935

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580

$15.935

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One Stop Electronics

USA . 302 parts In-Stock

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$21.000

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302

$21.000

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Corohmni

South Africa . 17 parts In-Stock

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$26.736

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17

$26.736

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Parana Technologies

USA . 971 parts In-Stock

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$71.165

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971

$71.165

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IDEA Electronic Components Group

UK . 1,436 parts In-Stock

1+ parts

$79.961

100+ parts

$75.963

1k+ parts

$71.965

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1,436

$79.961

$75.963

$71.965

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ChromeModa Solutions

Germany . 64 parts In-Stock

1+ parts

$79.961

100+ parts

$65.568

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64

$79.961

$65.568

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Corphita

USA . 3,414 parts In-Stock

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DigiPath Technology Company

USA . 147 parts In-Stock

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$72.093

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147

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$72.093

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Overview

Upgrade your electronic devices with the SN74LS481N1 by Texas Instruments, a top-notch Bit-Slice Micro Processor that guarantees high-quality performance and reliability. With Texas Instruments' reputation for cutting-edge technology and innovation, this product offers unparalleled value and benefits to customers. Perfect for a wide range of applications, this chip ensures seamless operation and efficiency, making it a must-have for any tech enthusiast or professional. Trust Texas Instruments for superior quality and choose the SN74LS481N1 for all your micro processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and can withstand environmental factors, making the product suitable for a variety of applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient utilization of space and easy integration into existing systems.

No. of Terminals: 48

Having 48 terminals allows for increased connectivity options and flexibility in designing electronic circuits.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can operate reliably in various environments without overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures the product's reliability in both low and high-temperature conditions.

Technology: TTL

Using TTL technology ensures high-speed processing and low power consumption, making the product efficient and reliable.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Being a bit-slice microprocessor, the product offers modular design and scalability for complex processing tasks.

Technical Specifications

Bit-Slice Micro Processors SN74LS481N1 attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74LS481N1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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