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SNJ54AS890GB

Texas Instruments

SNJ54AS890GB by Texas Instruments

SNJ54AS890GB by Texas Instruments is a Bit-Slice Micro Processor with 68 terminals in a ceramic grid array package. Operating temperature ranges from -55°C to 125°C, suitable for military-grade applications. It features TTL technology and serves as a microprogram sequencer for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,359 parts In-Stock

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6,359

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Digiode

USA . 2,319 parts In-Stock

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2,319

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Distributors (Availability)

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One Stop Electronics

USA . 1,413 parts In-Stock

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$12.000

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1,413

$12.000

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AZTECH Wire

Italy . 830 parts In-Stock

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$15.407

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830

$15.407

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Corohmni

South Africa . 63 parts In-Stock

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$33.216

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63

$33.216

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Parana Technologies

USA . 1,409 parts In-Stock

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$47.149

100+ parts

$4,378.466

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$42.434

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1,409

$47.149

$4,378.466

$42.434

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DigiPath Technology Company

USA . 1,706 parts In-Stock

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$51.916

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1,706

$51.916

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ChromeModa Solutions

Germany . 3,385 parts In-Stock

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$52.976

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$43.440

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3,385

$52.976

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IDEA Electronic Components Group

UK . 367 parts In-Stock

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$52.976

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$50.327

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$47.678

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367

$52.976

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$47.678

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Corphita

USA . 1,205 parts In-Stock

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Overview

Elevate your electronic designs with the SNJ54AS890GB by Texas Instruments. Crafted with precision and expertise, this bit-slice micro processor offers unparalleled performance and reliability. Ideal for military-grade applications, this advanced technology ensures seamless operation in extreme conditions. Experience the value of Texas Instruments' cutting-edge solutions and unlock a world of possibilities for your projects. Trust in the quality and innovation of Texas Instruments to take your designs to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and excellent resistance to heat, making it ideal for military-grade applications where reliability is crucial.

Screening Level: 38535Q/M;38534H;883B

This high screening level ensures that the product meets stringent military standards for reliability and performance, making it suitable for demanding environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microprocessor can withstand extreme temperatures without compromising its functionality, making it suitable for harsh operating conditions.

Technology: TTL

TTL technology provides fast switching speeds and low power consumption, making this microprocessor efficient and reliable for high-performance applications.

Technical Specifications

Bit-Slice Micro Processors SNJ54AS890GB attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P68

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

SNJ54AS890GB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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