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ADSP-1402TG

Analog Devices

ADSP-1402TG by Analog Devices

ADSP-1402TG by Analog Devices is a Bit-Slice Micro Processor with 84 terminals in a ceramic square package. Operating temperature ranges from -55 °C to 125°C, suitable for military-grade applications. Features CMOS technology and a grid array style package with tin/lead terminal finish.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 11,398 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 728 parts In-Stock

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$8.681

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One Stop Electronics

USA . 1,251 parts In-Stock

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$20.000

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Corohmni

South Africa . 1,892 parts In-Stock

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Semicontronic

India . 975 parts In-Stock

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Parana Technologies

USA . 449 parts In-Stock

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$33.727

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$31.366

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Native Components

USA . 366 parts In-Stock

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IDEA Electronic Components Group

UK . 909 parts In-Stock

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Northwest PG Solutions

USA . 2,047 parts In-Stock

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DigiPath Technology Company

USA . 2,375 parts In-Stock

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$56.575

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$54.312

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Corphita

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Overview

Elevate your electronics projects with the ADSP-1402TG by Analog Devices, a top-tier manufacturer renowned for cutting-edge technology. This bit-slice microprocessor offers unparalleled performance and reliability, making it ideal for a wide range of applications. With its military-grade temperature grade and CMOS technology, this product ensures optimal functionality even in extreme conditions. Upgrade your designs today with the ADSP-1402TG and experience the difference in quality and efficiency that only Analog Devices can deliver.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity, making it ideal for high temperature operations and enhancing the overall reliability of the product.

Package Shape: SQUARE

Square packages are generally more space-efficient and provide better thermal performance compared to other shapes, making the product suitable for compact designs.

No. of Terminals: 84

Having a high number of terminals allows for more connections and functionalities to be integrated into the product, increasing its overall processing capabilities.

Package Style (Meter): GRID ARRAY

Grid arrays provide better electrical performance and signal integrity, making the product suitable for high-speed processing applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extreme environmental conditions, ensuring reliable operation in harsh environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the product to function effectively in cold conditions, making it versatile for various operating environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability and easy integration into electronic systems.

Terminal Position: PERPENDICULAR

Perpendicular terminal position allows for easier insertion and removal of the product, simplifying maintenance and upgrades in electronic systems.

Temperature Grade: MILITARY

Military-grade temperature rating indicates that the product meets stringent quality standards and reliability requirements, making it suitable for mission-critical applications.

Peripheral IC Type: BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

The inclusion of bit-slice processor and microprogram sequencer technologies enhances the processing capabilities and flexibility of the product, making it suitable for complex computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for extended operation.

Terminal Form: PIN/PEG

Pin/peg terminal form provides secure connections and mechanical stability, ensuring reliable operation and ease of integration into electronic systems.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm allows for compatibility with commonly available connectors and PCB layouts, making the product easy to incorporate into existing designs.

Technical Specifications

Bit-Slice Micro Processors ADSP-1402TG attributes and parameters. Explore more Bit-Slice Micro Processors devices from Analog Devices

Specs

JESD-30 Code:

S-XPGA-P84

JESD-609 Code:

e0

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA84M,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

ADSP-1402TG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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