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IDT7381L25J

Integrated Device Technology

IDT7381L25J by Integrated Device Technology

IDT7381L25J by Integrated Device Technology is a Bit-Slice Micro Processor with 16-bit external data bus width, operating at a max clock frequency of 50 MHz. It features a package style of CHIP CARRIER and is suitable for commercial applications requiring high-speed processing capabilities within the temperature range of 0 to 70°C.

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Nova Conductors

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Atlantic Semiconductor

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Legend Electronics Inc.

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Ampacity Inc.

Singapore . 568 parts In-Stock

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Overview

Experience top-notch performance with the IDT7381L25J from Integrated Device Technology. As a leading manufacturer in the industry, IDT delivers high-quality Bit-Slice Micro Processors that are versatile and reliable for various applications. With a maximum clock frequency of 50 MHz and a wide external data bus width of 16, this chip carrier package offers exceptional value and benefits to customers. Trust in IDT for cutting-edge technology and seamless integration, making your projects run smoothly and efficiently.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, enhancing the overall reliability of the product.

Surface Mount: YES

Surface mount capability ensures easy and efficient PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

Square package shape enables easy orientation and alignment during installation, simplifying the mounting process.

No. of Terminals: 68

Higher number of terminals provide increased input/output options, enabling more complex functionalities.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a compact form factor, saving space on the PCB and facilitating dense circuit designs.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage helps in reducing power consumption and heat generation, improving energy efficiency.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

Wide minimum operating temperature range allows for operation in both hot and cold environments, increasing versatility.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring secure and reliable connections.

Terminal Position: QUAD

Quad terminal position facilitates easy integration with other components, streamlining the overall circuit layout.

Maximum Seated Height: 4.57 mm

Low maximum seated height helps in achieving a compact and slim design for the product, ideal for space-constrained applications.

Width: 24.2062 mm

Standard width dimension allows for easy compatibility with standard PCB layouts and enclosure designs.

External Data Bus Width: 16

16-bit external data bus width enables efficient data transfer and processing, enhancing overall system performance.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency supports fast data processing and real-time operations, suitable for performance-critical applications.

Maximum Time At Peak Reflow Temperature (s): 20

Short time at peak reflow temperature reduces the risk of thermal damage during assembly, ensuring product reliability.

Peak Reflow Temperature °C: 225

High peak reflow temperature capability facilitates lead-free soldering processes, complying with environmental regulations.

Length: 24.2062 mm

Standard length dimension allows for easy integration into existing designs and enclosure configurations.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard commercial operating environments, providing broad market compatibility.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

Specialized bit-slice microprocessor technology offers enhanced computing capability and flexibility for various applications.

Technology: CMOS

CMOS technology enables low power consumption, high-speed operation, and reliable performance, making the product energy-efficient and cost-effective.

Terminal Form: J BEND

J bend terminal form simplifies the soldering process and ensures secure connections, enhancing overall product durability and reliability.

Maximum Supply Current: 76 mA

Low maximum supply current requirement minimizes power consumption and heat dissipation, contributing to energy efficiency.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent and reliable operation of the product, meeting performance requirements.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy PCB layout and component placement, facilitating efficient assembly and maintenance.

Technical Specifications

Bit-Slice Micro Processors IDT7381L25J attributes and parameters. Explore more Bit-Slice Micro Processors devices from Integrated Device Technology

Specs

Additional Features:

2 X 16 BIT DATA INPUT BUS; 3 CONTROL PINS TO SELECT OPERATION; ICC SPECIFIED @ 10MHZ

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.2062 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

225

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

76 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

24.2062 mm

Peripheral IC Type:

Trade Compliance

IDT7381L25J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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