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ADSP-1402KG

Analog Devices

ADSP-1402KG by Analog Devices

ADSP-1402KG by Analog Devices is a Bit-Slice Micro Processor with 84 terminals in a ceramic square package. Operating temperature ranges from 0 to 70 °C, suitable for commercial applications. It features CMOS technology and serves as a bit-slice processor with microprogram sequencer capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 10,827 parts In-Stock

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Digiode

USA . 28 parts In-Stock

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Semicontronic

India . 765 parts In-Stock

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$5.000

100+ parts

$4.875

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$4.850

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765

$5.000

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$4.850

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AZTECH Wire

Italy . 572 parts In-Stock

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$17.743

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One Stop Electronics

USA . 1,227 parts In-Stock

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$19.000

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Corohmni

South Africa . 184 parts In-Stock

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$33.782

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Native Components

USA . 693 parts In-Stock

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$34.997

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$33.597

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Northwest PG Solutions

USA . 2,138 parts In-Stock

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$38.497

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Parana Technologies

USA . 1,227 parts In-Stock

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$77.174

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$71.772

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IDEA Electronic Components Group

UK . 331 parts In-Stock

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$82.983

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$78.834

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DigiPath Technology Company

USA . 2,808 parts In-Stock

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$129.453

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$124.275

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Corphita

USA . 561 parts In-Stock

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Kepictronics

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Overview

Unleash the power of cutting-edge technology with the Analog Devices ADSP-1402KG Bit-Slice Micro Processor. Renowned for its exceptional quality and reliability, Analog Devices is a trusted name in the industry. This versatile processor is perfect for a wide range of applications, offering customers unmatched value and benefits. Whether you're looking to enhance your industrial automation system or upgrade your embedded control applications, the ADSP-1402KG delivers superior performance and efficiency. Stay ahead of the competition with Analog Devices and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and mechanical strength, making them suitable for high-performance microprocessors.

Package Shape: SQUARE

Square packages provide efficient use of space and allow for easy mounting on circuit boards.

No. of Terminals: 84

Having a high number of terminals allows for more connectivity options and flexibility in designing complex circuits.

Package Style (Meter): GRID ARRAY

Grid array packages offer high density and reliability, ideal for applications requiring compact designs and high reliability.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the processor can handle demanding tasks without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the processor to function reliably in a wide range of temperature conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and conductivity for reliable connections in electronic circuits.

Terminal Position: PERPENDICULAR

Perpendicular terminal position allows for easy insertion and removal of the processor from circuit boards.

Temperature Grade: COMMERCIAL

Commercial temperature grade means the processor is designed for standard operating environments, suitable for most commercial applications.

Peripheral IC Type: BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

Having a bit-slice processor and microprogram sequencer integrated into one IC provides efficient processing and control capabilities for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the processor energy-efficient and reliable.

Terminal Form: PIN/PEG

Pin/Peg terminal form allows for easy connections to other components and peripherals, enhancing the versatility of the processor.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm ensures compatibility with common circuit board layouts and components for easy integration.

Technical Specifications

Bit-Slice Micro Processors ADSP-1402KG attributes and parameters. Explore more Bit-Slice Micro Processors devices from Analog Devices

Specs

JESD-30 Code:

S-XPGA-P84

JESD-609 Code:

e0

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA84M,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

ADSP-1402KG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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