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ADSP-1410JP

Analog Devices

ADSP-1410JP by Analog Devices

ADSP-1410JP by Analog Devices is a Bit-Slice Micro Processor with 16-bit external data bus width, operating at max 10 MHz clock frequency. It is used in applications requiring microprogram sequencing and features CMOS technology, quad terminal position, and 52 terminals in a chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,154 parts In-Stock

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3,154

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Digiode

USA . 429 parts In-Stock

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429

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Distributors (Availability)

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Northwest PG Solutions

USA . 52 parts In-Stock

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$2.744

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52

$2.744

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AZTECH Wire

Italy . 821 parts In-Stock

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$6.744

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821

$6.744

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Semicontronic

India . 719 parts In-Stock

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$8.000

100+ parts

$7.800

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$7.760

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719

$8.000

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$7.760

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One Stop Electronics

USA . 1,515 parts In-Stock

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$20.000

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1,515

$20.000

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Corohmni

South Africa . 104 parts In-Stock

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$40.022

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104

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Parana Technologies

USA . 325 parts In-Stock

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$61.730

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$57.409

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325

$61.730

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$57.409

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IDEA Electronic Components Group

UK . 76 parts In-Stock

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$66.376

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$63.057

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DigiPath Technology Company

USA . 2,880 parts In-Stock

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$103.547

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$99.405

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$99.405

2,880

$103.547

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$99.405

Corphita

USA . 917 parts In-Stock

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917

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Native Components

USA . 580 parts In-Stock

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$2.420

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580

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$2.420

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Overview

Unleash the power of innovation with the Analog Devices ADSP-1410JP Bit-Slice Micro Processor. Crafted by a trusted manufacturer known for top-quality products, this processor opens up a world of possibilities in various applications. With a seamless blend of cutting-edge technology and reliable performance, the ADSP-1410JP offers unmatched value and benefits to customers seeking superior quality and efficiency. Elevate your projects to new heights with this game-changing processor at the heart of your design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and facilitating automated manufacturing processes.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage provides a wider operating range and tolerance, making the product suitable for various applications.

Package Shape: SQUARE

The square package shape ensures uniformity in design, making it easier to integrate into circuit layouts.

Power Supplies (V): 5

The standard power supply of 5V makes it compatible with most existing systems and easy to incorporate into new designs.

No. of Terminals: 52

The high number of terminals allows for connectivity to multiple components and peripherals, enhancing the product's functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers protection and efficient heat dissipation, ensuring the reliability and performance of the product.

Minimum Supply Voltage: 4.75 V

The lower minimum supply voltage enhances energy efficiency and reduces power consumption during operation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures the product can perform reliably in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance even in colder settings, increasing the product's versatility.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and conductivity, ensuring secure connections and efficient data transmission.

Terminal Position: QUAD

The quad terminal position design facilitates easy installation and maintenance, reducing the risk of errors during assembly.

Maximum Seated Height: 4.57 mm

The compact maximum seated height enables a slim profile and space-saving design, ideal for applications with limited space.

Width: 19.1262 mm

The moderate width allows for easy integration into standard PCB layouts, ensuring compatibility with various systems.

External Data Bus Width: 16

The wide external data bus width enables high-speed data processing and efficient communication between components, enhancing overall system performance.

Maximum Clock Frequency: 10 MHz

The high maximum clock frequency allows for fast data processing and real-time operation, making the product suitable for demanding applications.

Length: 19.1262 mm

The moderate length ensures a balanced form factor and easy integration into standard PCB layouts, simplifying the design process.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in typical commercial settings, making the product suitable for a wide range of applications.

Peripheral IC Type: BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

The inclusion of bit-slice processor and microprogram sequencer peripheral IC types enhances the product's computing capabilities and processing power.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high speed, and reliable operation, making it a cost-effective and efficient choice.

Terminal Form: J BEND

The J bend terminal form simplifies the installation process and reduces the risk of damage during handling, ensuring secure and reliable connections.

Maximum Supply Current: 75 mA

The moderate maximum supply current requirement ensures efficient power usage and helps prevent overheating or electrical issues during operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies the integration of the product into existing systems.

Terminal Pitch: 1.27 mm

The small terminal pitch enables a compact design and allows for high-density mounting, optimizing space usage on the PCB.

Technical Specifications

Bit-Slice Micro Processors ADSP-1410JP attributes and parameters. Explore more Bit-Slice Micro Processors devices from Analog Devices

Specs

Maximum Clock Frequency:

10 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e0

Length:

19.1262 mm

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.1262 mm

Trade Compliance

ADSP-1410JP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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