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SBP0401AMJ

Texas Instruments

SBP0401AMJ by Texas Instruments

Texas Instruments SBP0401AMJ is a military-grade bit-slice microprocessor with bipolar technology. It features 40 terminals in an inline package, operating from -55°C to 125°C. Ideal for applications requiring high reliability and performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,047 parts In-Stock

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4,047

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Digiode

USA . 1,133 parts In-Stock

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1,133

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,558 parts In-Stock

1+ parts

$2.000

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1,558

$2.000

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AZTECH Wire

Italy . 567 parts In-Stock

1+ parts

$16.698

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567

$16.698

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Parana Technologies

USA . 130 parts In-Stock

1+ parts

$47.332

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130

$47.332

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DigiPath Technology Company

USA . 453 parts In-Stock

1+ parts

$52.118

100+ parts

$47.949

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453

$52.118

$47.949

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ChromeModa Solutions

Germany . 3,727 parts In-Stock

1+ parts

$53.182

100+ parts

$43.609

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3,727

$53.182

$43.609

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IDEA Electronic Components Group

UK . 1,362 parts In-Stock

1+ parts

$53.182

100+ parts

$50.523

1k+ parts

$47.864

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1,362

$53.182

$50.523

$47.864

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Corohmni

South Africa . 2,355 parts In-Stock

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$72.753

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2,355

$72.753

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Corphita

USA . 2,255 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SBP0401AMJ from Texas Instruments. Crafted with precision and reliability, this Bit-Slice Micro Processor offers unparalleled performance in military-grade applications. Experience seamless functionality and optimal efficiency with its advanced design and robust construction. Elevate your projects to new heights with the SBP0401AMJ - the perfect choice for demanding environments where quality and innovation matter most.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity, ensuring efficient heat dissipation and improving overall reliability of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration into various system designs and provides more flexibility in placement on a circuit board.

No. of Terminals: 40

Having 40 terminals allows for more connectivity options and interfaces with other components, making the product versatile and suitable for a range of applications.

Package Style (Meter): IN-LINE

The in-line package style makes it easier to align and mount the microprocessor on a circuit board, simplifying the assembly process and reducing the risk of errors.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microprocessor can withstand demanding environments and perform reliably under intense heat conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the microprocessor can also function effectively in cold environments, expanding its usability in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal positions provide redundancy and improve signal integrity, enhancing the overall performance and reliability of the product.

Temperature Grade: MILITARY

Being designed for military-grade applications, this microprocessor meets stringent performance and reliability standards, making it a durable and robust choice for critical operations.

Peripheral IC Type: BIT-SLICE MICROPROCESSOR

The use of bit-slice microprocessor technology allows for efficient and scalable processing capabilities, making it ideal for handling complex tasks and computations effectively.

Technology: BIPOLAR

Bipolar technology offers high speed and precision, making this microprocessor suitable for applications requiring fast and accurate data processing.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and are easier to solder, ensuring secure attachment to the circuit board and enhancing the product's overall durability.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy integration with standard connectors and sockets, simplifying the assembly process and facilitating compatibility with existing systems.

Technical Specifications

Bit-Slice Micro Processors SBP0401AMJ attributes and parameters. Explore more Bit-Slice Micro Processors devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Bit-Slice Processors

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SBP0401AMJ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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